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arXiv 1605.06006cond-mat.mtrl-sci
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基于Al/Si3N4/p-Si MIS的阻变存储器件的阻变特性

Resistive Switching Characteristics of Al/Si3N4/p-Si MIS-Based Resistive Switching Memory Devices

Min Ju Yun, Sungho Kim, Hee-Dong Kim

摘要:

在本研究中,我们提出并论证了一种以p型硅(p-Si)为底电极的氮化硅(Si 3 N4)基阻变存储器件的自整流特性。采用低压化学气相沉积法制备了Al/Si_3N_4/p-Si结构的RRAM器件,该器件具有本征二极管特性和非线性电流-电压特性。此外,与Al/Si 3 N4/Ti RRAM单元的传统金属/绝缘体/金属(MIM)结构相比,所提出的金属/绝缘体/半导体(MIS)单元的整个偏置区域中的操作电流已经显著降低,因为引入的p-Si底部电极有效地抑制了低阻态和高阻态中的电流。因此,结果意味着通过采用p-Si作为底部电极,基于Si 3 N4的RRAM单元可以应用于无选择器的RRAM单元。

英文摘要:

In this study, we proposed and demonstrated a self-rectifying property of silicon nitride (Si3N4)-based resistive random access memory device by employing p-type silicon (p-Si) as bottom electrode. The RRAM devices consisted of Al/Si3N4/p-Si are fabricated by a low presure chemical vapor deposition and exhibited an intrinsic diode property with non-linear current-voltage (I-V) behavior. In addition, compared to conventional metal/insulator/metal (MIM) structure of Al/Si3N4/Ti RRAM cells, operating current in whole bias regions for proposed metal/insulator/semiconductor (MIS) cells has been dramatically lowered because introduced p-Si bottom electrode efficiently suppresses the current in both low and high resistive states. As a result, the results mean that by employing p-Si as bottom electrode the Si3N4-based RRAM cells can be applied to selector-free RRAM cells.

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