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arXiv 1402.6414cond-mat.mtrl-sci
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600 V/20 A 4 H- SiC肖特基势垒二极管的研制

Fabrication of a 600V/20A 4H-SiC Schottky Barrier Diode

In-Ho Kang, Sang-Cheol Kim, Jung-Hyeon Moon, Wook Bahng, Nam-Kyun Kim

摘要:

研制了600 V/20 A 4 H-SiC肖特基势垒二极管(SBD),研究了关键工艺步骤,特别是肖特基接触形成前后对SBD电学性能和长期可靠性的影响。结果表明,经470 ℃氢气氛退火10 min,离子激活后立即进行牺牲处理的4 H-SiC SBD在额定电流为20 A时具有较低的正向压降(VF),较高的阻断电压(800 V)和很短的反向恢复时间(17.5ns)。尽管有苛刻的反向偏置条件和温度,长期的可靠性测试表明,在正向电压降和反向漏电流(IR)的变化为0.7%和8.9%,阻断电压提高。这是由于钝化层和SiC之间的稳定界面,这是由老化引起的。

英文摘要:

600V/20A 4H-SiC Schottky barrier diodes (SBD) were fabricated to investigate the effect of key processing steps, especially before and after a formation of Schottky contact, on the electrical performances of SBD and on a long-term reliability. The results show that 4H-SiC SBDs, subjected to a hydrogen-ambient annealing at 470oC for 10min and sacrificial treatment right after ion activation, exhibited low forward voltage drop (VF) at a rated current of 20A, higher blocking voltage of 800V, and very short reverse recovery time of 17.5ns. Despite a harsh reverse bias condition and temperature, a long-term reliability test shows that changes in forward voltage drop and reverse leakage current (IR) were 0.7% and 8.9% and that blocking voltage was enhanced. This is attributed to a stabilized interface between passivation layer and SiC that is caused by aging.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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