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arXiv 1406.5809cond-mat.mtrl-sci
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将纳米结构清洁转移到各种基底上的通用快速方法

A Universal, Rapid Method for Clean Transfer of Nanostructures onto Various Substrates

Hai Li, Jumiati Wu, Xiao Huang, Zongyou Yin, Juqing Liu, Hua Zhang

摘要:

将纳米结构转移到目标基底上是其基础研究和实际应用的前提。涉及冲压、剥离和/或剥离的常规转移技术具有工艺特定的缺点,例如需要化学蚀刻剂或高温退火,以及引入表面不连续性和/或污染物,这会极大地阻碍转移材料的性能和功能。在这里,我们报告了一种通用的和快速的转移方法,可在温和的条件下实施。具有各种维度(即纳米颗粒、纳米线和纳米片)和表面性质(即亲水性和疏水性)的纳米结构可以轻松地转移到不同的基底上,包括具有良好保真度的亲水性、疏水性和柔性表面。重要的是,我们的方法确保了二维(2D)材料的快速和清洁转移,并允许用于电子器件的具有各种成分的垂直异质结构的简易制造。我们相信,我们的方法可以通过加速低维材料到多维结构的清洁转移和整合来促进纳米电子学的发展。

英文摘要:

Transfer and integration of nanostructures onto target substrates is the prerequisite for their fundamental studies and practical applications. Conventional transfer techniques that involve stamping, lift-off and/or striping suffer from the process-specific drawbacks, such as the requirement for chemical etchant or high-temperature annealing and the introduction of surface discontinuities and/or contaminations that can greatly hinder the properties and functions of the transferred materials. Herein, we report a universal and rapid transfer method implementable at mild conditions. Nanostructures with various dimensionalities (i.e. nanoparticles, nanowires and nanosheets) and surface properties (i.e. hydrophilic and hydrophobic) can be facilely transferred to diverse substrates including hydrophilic, hydrophobic and flexible surfaces with good fidelity. Importantly, our method ensures the rapid and clean transfer of two-dimensional (2D) materials, and allows for the facile fabrication of vertical heterostructures with various compositions used for electronic devices. We believe that our method can facilitate the development of nano-electronics by accelerating the clean transfer and integration of low-dimensional materials into multidimensional structures.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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