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arXiv 1307.7868cond-mat.mtrl-scicond-mat.mes-hall
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半导体中载流子输运的热弹方法

The thermoballistic approach to charge carrier transport in semiconductors

R. Lipperheide, U. Wille

摘要:

本文综述了半导体中载流子输运的热弹方法。这种半经典的方法之间的差距桥梁漂移扩散和弹道(“弹道”)模型的载流子输运,其有效性是有限的范围内的非常小和非常大的值,分别载体的平均自由path.The物理概念的基础上的热弹道的方法,同时结合漂移扩散和弹道的描述的基本特征,构成了一个新的,统一的计划。它是基于引入“弹道配置”定义的随机分区的长度的半导体样品到弹道输运的间隔,这是由当地的热力学平衡点,在该载流子被发射或吸收。通过对所有弹道构型的弹道间隔中的载流子电流进行平均,导出了任意大小的载流子平均自由程的位置相关热弹道电流,该电流是热弹道概念的关键元素,也是计算各种输运量的出发点。本文首先介绍标准漂移扩散模型和弹道输运模型,以及为这一概念的充分发展形式铺平道路的原型模型。在文章的主体,一个连贯的论述的热弹道方法内给出了一个一般的配方,考虑到任意形状,自旋分裂势能分布和自旋弛豫在整个弹道间隔的载流子运动。计算程序设计实现热弹道的概念进行了说明。被认为是与当今的半导体和自旋电子学研究的具体例子。

英文摘要:

A comprehensive survey is given of the thermoballistic approach to charge carrier transport in semiconductors. This semiclassical approach bridges the gap between the drift-diffusion and ballistic ("thermionic") models of carrier transport, whose validity is limited to the range of very small and very large values, respectively, of the carrier mean free path. The physical concept underlying the thermoballistic approach, while incorporating basic features of the drift-diffusion and ballistic descriptions, constitutes a novel, unifying scheme. It is based on the introduction of "ballistic configurations" defined by a random partitioning of the length of a semiconducting sample into ballistic transport intervals, which are linked by points of local thermodynamic equilibrium at which carriers are emitted or absorbed. By averaging the carrier currents in the ballistic intervals over all ballistic configurations, a position-dependent thermoballistic current is derived for arbitrary magnitude of the carrier mean free path. This current is the key element of the thermoballistic concept and forms the point of departure of the calculation of various transport quantities. The present article starts out with an account of the standard drift-diffusion and ballistic transport models, and of a prototype model which paves the way for the fully developed form of that concept. In the main body of the article, a coherent exposition of the thermoballistic approach is given within a general formulation that takes into account arbitrarily shaped, spin-split potential energy profiles and spin relaxation during the carrier motion across ballistic intervals. The calculational procedures devised for implementing the thermoballistic concept are described. Specific examples relevant to present-day semiconductor and spintronics research are considered.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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