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arXiv 1010.3487cond-mat.mes-hall
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具有电诱导源/漏扩展的纳米级SOI-MOSFET:抑制短沟道效应的新特性和设计考虑

Nanoscale SOI-MOSFETs with Electrically Induced Source/Drain Extension: Novel attributes and Design considerations for Suppressed Short-channel Effects

Ali A. Orouji, M. Jagadesh Kumar

摘要:

提出了一种沟道长度小于100 nm的浅源漏结SOI MOSFET的设计思路。我们的模拟结果表明,诱导源/漏扩展的SOI MOSFET的应用将成功地控制SCE和提高击穿电压,即使沟道长度小于50 nm。我们的结论是,如果侧栅长度等于主栅长度,热电子效应最佳地减小。

英文摘要:

Design considerations for a below 100 nm channel length SOI MOSFET with electrically induced shallow source/drain junctions are presented. Our simulation results demonstrate that the application of induced source/drain extensions to the SOI MOSFET will successfully control the SCEs and improve the breakdown voltage even for channel lengths less than 50 nm. We conclude that if the side gate length equals the main gate length, the hot electron effect diminishes optimally.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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