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arXiv 2101.00519cond-mat.mtrl-sci
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多晶Al层的深度分辨率优化溅射深度剖析

Depth resolution optimized sputter depth profiling of a polycrystalline Al layer

Uwe Scheithauer

摘要:

利用惰性气体溅射技术对薄膜进行深度剖析是俄歇电子能谱和X射线光电子能谱学的重要应用之一。这种分析监测薄膜系统的元素深度组成并控制制造过程的质量。溅射深度轮廓测量的一个挑战性任务是确定界面污染。界面污染只有在深度剖面数据以足够的深度分辨率测量时才能检测到。界面污染是至关重要的,因为它们强烈地影响整个薄膜系统的机械和电性能。多晶样品的单向溅射深度剖析的深度分辨率受到归因于相对于入射离子束具有不同晶体取向的晶粒的溅射产率差异的限制。因此,多晶薄膜的深度分辨率优化溅射深度剖析需要专门的实验方法。如果样品在离子溅射过程中旋转,则由于相对于晶粒取向的离子撞击方向变化,因此以更好的深度分辨率记录深度分布。如果可以仅对单个颗粒执行深度剖析,则深度分辨率也得到改善。这些方法被应用到5000 nm厚的多晶Al层的深度剖析和界面污染分析。利用这些高深度分辨率的深度剖析方法检测到在Al到Si衬底的界面处的O污染。

英文摘要:

Depth profiling of thin films by inert gas sputtering is one of the most important applications of Auger electron spectroscopy and X-ray photoelectron spectroscopy. Such an analysis monitors the elemental in-depth composition of the thin film system and controls the quality of the manufacturing process. A challenging task of a sputter depth profile measurement is the determination of the interface contaminations. Interface contaminations are only detectable if the depth profile data were measured with a sufficient depth resolution. Interface contaminations are crucial, because they strongly influence the mechanical and electrical properties of the whole thin film system. The depth resolution of unidirectional sputter depth profiling for polycrystalline samples is limited by the sputter yield differences attributed to grains having different crystalline orientations relative to the incoming ion beam. Therefore depth resolution optimized sputter depth profiling of polycrystalline thin films requires dedicated experimental approaches. If the sample is rotated during ion sputtering the depth profile is recorded with a better depth resolution because the ion impact direction relative to the grains orientation varies. If depth profiling can be performed on a single grain only, the depth resolution is improved, too. These approaches are applied to the depth profiling and interface contamination analysis of a 5000 nm thick polycrystalline Al layer. An O contamination at the interface of the Al to the Si substrate was detected utilizing these high depth resolution depth profiling methods.

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