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arXiv 1302.6689cond-mat.mtrl-sci
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分析用AES和XPS仪器中溅射引起的交叉污染:超薄功能层原位沉积效应的利用

Sputter-Induced Cross-Contaminations in Analytical AES and XPS Instrumentation: Utilization of the effect for the In-situ Deposition of Ultrathin Functional Layers

Uwe Scheithauer

摘要:

如果将多个样品安装在一个样品架上,并对相邻样品进行溅射深度分析,则通过AES和XPS在样品表面上观察到交叉污染。在溅射深度剖析期间,溅射材料沉积在仪器的内表面上。在二次溅射过程中,这是由于物质以更高的动能离开主溅射靶,先前沉积的材料从内表面传输到安装在样品保持器上的其他样品。这种反射溅射用于在样品表面沉积超薄层,用于XPS结合能参考目的,并建立超薄导电层,以实现绝缘样品的AES测量。

英文摘要:

Cross contaminations are observed on sample surfaces by AES and XPS, if multiple samples are mounted on one sample holder and a neighbouring sample was sputter depth profiled. During sputter depth profiling sputtered material is deposited on inner surfaces of the instrument. In a secondary sputter process, which is due to species leaving the primary sputter target with higher kinetic energy, the previously deposited material is transported from the inner surfaces to the other samples mounted on the sample holder. This Reflective Sputtering is utilized to deposit ultra-thin layers on sample surfaces for XPS binding energy referencing purpose and to build up ultra-thin conductive layers to enable AES measurements on insulating samples.

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