arXivDaily arXiv每日学术速递 周一至周五更新
arXiv 2008.11078cond-mat.mtrl-sciphysics.app-ph
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表面声子限制薄膜中的热传导

Surface phonons limit heat conduction in thin films

Michimasa Morita, Takuma Shiga

摘要:

了解薄膜中的微观热传导对于先进电子学的纳米/微米传热和热管理具有重要意义。由于薄膜的厚度与声子波长相当或比声子波长更短,声子色散关系和输运性质被显著调制,这应该被考虑用于薄膜中的热传导。虽然已经考虑了声子限制和耗尽效应,但应该强调的是,由于高的表面积与体积比,表面局域声子(表面声子)对热传导的影响可能不可忽略。然而,到目前为止,表面声子在热传导中的作用很少受到关注。在目前的工作中,我们进行了非谐晶格动力学计算的表面声子方面的厚度和温度的依赖关系的硅薄膜与亚10 nm厚度的面内热导率的调查。通过系统分析表面声子的影响,我们发现局域在薄膜中的表面声子和内部声子之间的非谐耦合显著抑制了薄膜中的整体面内热传导。我们还发现,特定的低频表面声子显着有助于表面-内部声子散射和热传导抑制。我们的研究结果是有益的电子和声子器件的热管理,并可能导致表面声子工程的热导率控制。

英文摘要:

Understanding microscopic heat conduction in thin films is important for nano/micro heat transfer and thermal management for advanced electronics. As the thickness of thin films is comparable to or shorter than a phonon wavelength, phonon dispersion relations and transport properties are significantly modulated, which should be taken into account for heat conduction in thin films. Although phonon confinement and depletion effects have been considered, it should be emphasized that surface-localized phonons (surface phonons) arise whose influence on heat conduction may not be negligible due to the high surface-to-volume ratio. However, the role of surface phonons in heat conduction has received little attention thus far. In the present work, we performed anharmonic lattice dynamics calculations to investigate the thickness and temperature dependence of in-plane thermal conductivity of silicon thin films with sub-10-nm thickness in terms of surface phonons. Through systematic analysis of the influences of surface phonons, we found that anharmonic coupling between surface and internal phonons localized in thin films significantly suppresses overall in-plane heat conduction in thin films. We also discovered that specific low-frequency surface phonons significantly contribute to surface--internal phonon scattering and heat conduction suppression. Our findings are beneficial for the thermal management of electronics and phononic devices and may lead to surface phonon engineering for thermal conductivity control.

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