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arXiv 1809.04779cond-mat.mtrl-sci
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利用原位量子传感器对半导体器件能带弯曲的空间映射

Spatial mapping of band bending in semiconductor devices using in-situ quantum sensors

D. A. Broadway, N. Dontschuk, A. Tsai, S. E. Lillie, C. T. -K. Lew, J. C. McCallum, B. C. Johnson, M. W. Doherty, A. Stacey, L. C. L. Hollenberg, J. -P. Tetienne

摘要:

能带弯曲是固态物理学中的一个核心概念,它源于电荷分布的局部变化,特别是在半导体界面和表面附近。它的精确测量在从场效应晶体管的优化到具有增强的稳定性和相干性的量子位器件的工程设计的各种背景下都是至关重要的。现有的方法是表面敏感的,不能探测与晶体缺陷相关的表面或体电荷深度处的能带弯曲。在这里,我们提出了一种原位方法,用于探测带弯曲的半导体器件通过成像的原子大小的量子传感缺陷的阵列上的局部电场报告。我们使用金刚石中的氮空位中心来实现这一概念,并绘制了各种表面终端下不同深度处的电场。然后,我们制造一个双端设备的基础上形成的导电的二维空穴气在氢终止的金刚石表面,并观察到一个意想不到的空间调制的电场归因于电荷注入和光电离效应之间的复杂的相互作用。我们的方法开辟了道路,以三维映射的能带弯曲的钻石和其他半导体托管合适的量子传感器,结合在复杂的操作设备中的电荷传输的同时成像。

英文摘要:

Band bending is a central concept in solid-state physics that arises from local variations in charge distribution especially near semiconductor interfaces and surfaces. Its precision measurement is vital in a variety of contexts from the optimisation of field effect transistors to the engineering of qubit devices with enhanced stability and coherence. Existing methods are surface sensitive and are unable to probe band bending at depth from surface or bulk charges related to crystal defects. Here we propose an in-situ method for probing band bending in a semiconductor device by imaging an array of atomic-sized quantum sensing defects to report on the local electric field. We implement the concept using the nitrogen-vacancy centre in diamond, and map the electric field at different depths under various surface terminations. We then fabricate a two-terminal device based on the conductive two-dimensional hole gas formed at a hydrogen-terminated diamond surface, and observe an unexpected spatial modulation of the electric field attributed to a complex interplay between charge injection and photo-ionisation effects. Our method opens the way to three-dimensional mapping of band bending in diamond and other semiconductors hosting suitable quantum sensors, combined with simultaneous imaging of charge transport in complex operating devices.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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