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arXiv 1107.5401cond-mat.mtrl-sci
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MIS结构用ALD生长介质氧化物的性能和表征

Properties and characterization of ALD grown dielectric oxides for MIS structures

S. Gieraltowska, D. Sztenkiel, E. Guziewicz, M. Godlewski, G. Luka, B. S. Witkowski, L. Wachnicki, E. Lusakowska, T. Dietl, M. Sawicki

摘要:

我们报告了一个广泛的结构和电特性的栅极下的介质氧化物绝缘体的原子层沉积(ALD)生长的氧化铝和HfO 2。我们阐述了这些氧化物的ALD生长窗口,发现40-100 nm厚的两种氧化物层表现出良好的表面平整度和所需的非晶结构。这些层构成进一步金属栅极蒸发的基础,以完成金属-绝缘体-半导体结构。我们最好的器件能够在77 K下承受高达约3 MV/cm的电流,漏电流保持在1 nA的最先进水平以下。在这些条件下,位移电荷对应于3 \times 1013 cm-2的片载流子密度的变化,这保证了稀释铁磁半导体中的微磁特性的有效调制。

英文摘要:

We report on an extensive structural and electrical characterization of under-gate dielectric oxide insulators Al2O3 and HfO2 grown by Atomic Layer Deposition (ALD). We elaborate the ALD growth window for these oxides, finding that the 40-100 nm thick layers of both oxides exhibit fine surface flatness and required amorphous structure. These layers constitute a base for further metallic gate evaporation to complete the Metal-Insulator-Semiconductor structure. Our best devices survive energizing up to ~3 MV/cm at 77 K with the leakage current staying below the state-of-the-art level of 1 nA. At these conditions the displaced charge corresponds to a change of the sheet carrier density of 3 \times 1013 cm-2, what promises an effective modulation of the micromagnetic properties in diluted ferromagnetic semiconductors.

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