arXivDaily arXiv每日学术速递 周一至周五更新
arXiv 2008.02411physics.app-ph
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基于硅光子学平台的通用3D成像传感器

A universal 3D imaging sensor on a silicon photonics platform

Christopher Rogers, Alexander Y. Piggott, David J. Thomson, Robert F. Wiser, Ion E. Opris, Steven A. Fortune, Andrew J. Compston, Alexander Gondarenko, Fanfan M… 展开作者

Christopher Rogers, Alexander Y. Piggott, David J. Thomson, Robert F. Wiser, Ion E. Opris, Steven A. Fortune, Andrew J. Compston, Alexander Gondarenko, Fanfan Meng, Xia Chen, Graham T. Reed, Remus Nicolaescu

摘要:

精确的3D成像对于机器绘制地图并与物理世界进行交互至关重要。虽然存在许多3D成像技术,每种技术都以不同程度的成功解决了利基应用,但没有一种技术能够达到数字图像传感器在2D成像领域所实现的广泛适用性和影响力。作为光探测和测距(LiDAR)系统操作的相干探测器像素的大规模二维阵列可以用作通用3D成像平台。这种系统将提供高深度精度和抗阳光干扰能力,以及直接测量移动物体速度的能力。然而,由于难以向每个像素提供电连接和光子连接,先前的系统被限制为少于20个像素。在这里,我们展示了第一个大规模的相干探测器阵列组成的512($32 \times 16$)像素,其操作在三维成像系统。利用光子和电子电路的单片集成的最新进展,光外差检测器的密集阵列与集成的电子读出架构相结合,使直接缩放到任意大的阵列。同时,双轴固态光束转向消除了视场和范围之间的任何权衡。在量子噪声极限下工作,我们的系统仅使用$4~\mathrm{mW}$光在75米的距离处实现了$3.1~\mathrm{mm}$的精度,比现有的固态系统在这样的范围内精确一个数量级。未来使用最先进的组件来减小像素大小,可以为消费者相机传感器大小的阵列产生超过2000万像素的分辨率。这一结果为低成本、紧凑型和高性能3D成像相机的开发和普及铺平了道路。

英文摘要:

Accurate 3D imaging is essential for machines to map and interact with the physical world. While numerous 3D imaging technologies exist, each addressing niche applications with varying degrees of success, none have achieved the breadth of applicability and impact that digital image sensors have achieved in the 2D imaging world. A large-scale two-dimensional array of coherent detector pixels operating as a light detection and ranging (LiDAR) system could serve as a universal 3D imaging platform. Such a system would offer high depth accuracy and immunity to interference from sunlight, as well as the ability to directly measure the velocity of moving objects. However, due to difficulties in providing electrical and photonic connections to every pixel, previous systems have been restricted to fewer than 20 pixels. Here, we demonstrate the first large-scale coherent detector array consisting of 512 ($32 \times 16$) pixels, and its operation in a 3D imaging system. Leveraging recent advances in the monolithic integration of photonic and electronic circuits, a dense array of optical heterodyne detectors is combined with an integrated electronic readout architecture, enabling straightforward scaling to arbitrarily large arrays. Meanwhile, two-axis solid-state beam steering eliminates any tradeoff between field of view and range. Operating at the quantum noise limit, our system achieves an accuracy of $3.1~\mathrm{mm}$ at a distance of 75 metres using only $4~\mathrm{mW}$ of light, an order of magnitude more accurate than existing solid-state systems at such ranges. Future reductions of pixel size using state-of-the-art components could yield resolutions in excess of 20 megapixels for arrays the size of a consumer camera sensor. This result paves the way for the development and proliferation of low cost, compact, and high performance 3D imaging cameras.

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