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arXiv 2012.13336physics.app-ph
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集成拉曼光谱法测量硅光子学中的应力

Stress measurements in silicon photonics by integrated Raman spectroscopy

Guillaume Marcaud, Mathias Berciano, Christian Lafforgue, Carlos Alonso-Ramos, Xavier Le Roux, Thomas Maroutian, Guillaume Agnus, Pascal Aubert, Ludovic Largeau… 展开作者

Guillaume Marcaud, Mathias Berciano, Christian Lafforgue, Carlos Alonso-Ramos, Xavier Le Roux, Thomas Maroutian, Guillaume Agnus, Pascal Aubert, Ludovic Largeau, Eric Cassan, Sylvia Matzen, Delphine Marris-Morini, Philippe Lecoeur, Laurent Vivien

摘要:

光子和电子集成电路的复杂3D集成对于实现光子学路线图和解决挑战特别感兴趣,但涉及机械应力,通常对光学组件的行为有害。现有的实验未能仔细分析这种集成光学器件中的应力,这是由于在特征尺寸、几百纳米和3D堆叠集成方面的要求。我们提出了第一次的表征的应力张量的硅波导使用集成拉曼光谱(IRS)。这种实验技术是直接敏感的有效应力,其中涉及的导模的光学性质的变化,在工作波长和偏振态的光子组件。实验应力张量与模拟结果吻合较好。

英文摘要:

Complex 3D integration of photonic and electronic integrated circuits is of particular interest to carry the photonics roadmap and to address challenges but involves mechanical stress, often detrimental for the behavior of optical components. Existing experiments failed to carefully analyze the stress in such integrated optical devices due to the requirement in terms of feature sizes, few hundreds of nanometers, and 3D-stacked integration. We present for the first time the characterization of the stress tensor of a silicon waveguide using Integrated Raman Spectroscopy (IRS). This experimental technique is directly sensitive to the effective stress, which involves changes in optical properties of the guided mode, at the working wavelength and polarization state of the photonic component. The experimental stress tensor is in good agreement with simulations.

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