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arXiv 2402.04026physics.opticsphysics.app-ph
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4H碳化硅在氮化铝集成光子平台上的演示

Demonstration of 4H silicon carbide on aluminum nitride integrated photonics platform

Jingwei Li, Ruixuan Wang, Lutong Cai, Qing Li

AI总结:

本研究首次演示了4H碳化硅在氮化铝上的集成光子平台,通过替换底层材料并底切氮化铝,实现了高品质因数微环谐振器(高达180万)及高热导率测量,为光子集成提供了新方案。

摘要:

现有的绝缘体上碳化硅光子平台利用碳化硅下方的薄二氧化硅层来提供光学限制和模式隔离。在此,我们将下方的二氧化硅层替换为1微米厚的氮化铝,并首次演示了4H-碳化硅-在-氮化铝上的集成光子平台。我们制备了高效的 grating couplers(光栅耦合器)、低损耗波导以及本征品质因数高达210,000的紧凑型微环谐振器。此外,通过底切氮化铝层,碳化硅微环的本征品质因数提高了近一个数量级(达到180万)。最后,我们开发了一种光学泵浦-探测方法来测量氮化铝层的热导率,估算其热导率超过二氧化硅的30倍。

英文摘要:

The existing silicon-carbide-on-insulator photonic platform utilizes a thin layer of silicon dioxide under silicon carbide to provide optical confinement and mode isolation. Here, we replace the underneath silicon dioxide layer with a 1-$μ$m-thick aluminum nitride and demonstrate a 4H-silicon-carbide-on-aluminum-nitride integrated photonics platform for the first time. Efficient grating couplers, low-loss waveguides, and compact microring resonators with intrinsic quality factors up to 210,000 are fabricated. In addition, by undercutting the aluminum nitride layer, the intrinsic quality factor of the silicon carbide microring is improved by nearly one order of magnitude (1.8 million). Finally, an optical pump-probe method is developed to measure the thermal conductivity of the aluminum nitride layer, which is estimated to be over 30 times of that of silicon dioxide.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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