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arXiv 1906.03092physics.app-ph
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反应离子溅射法在4 H- SiC上沉积Al2O3薄膜及其性能

Properties of Al2O3 thin films deposited on 4H-SiC by reactive ion sputtering

P. Fiorenza, M. Vivona, S. Di Franco, E. Smecca, S. Sanzaro, A. Alberti, M. Saggio, F. Roccaforte

摘要:

本工作采用反应离子溅射法制备了Al_2O_3薄膜,通过形貌、化学和电学表征等手段研究了薄膜的电学性能。该绝缘层遭受电子俘获,该电子俘获在快速热退火(RTA)之后减轻。RTA还改善了介电常数(高达6ε0),尽管负固定电荷保持在1012 cm-2的量级。然而,MOS电容器的温度相关的电气调查表明,室温Fowler-Nordheim电子势垒高度为2.37 eV之间的SiO2/4 H-SiC和Al 2 O3/4 H-SiC系统的预期值。

英文摘要:

In this work, the electrical properties of Al2O3 films deposited by reactive ion sputtering were investigated by means of morphological, chemical and electrical characterizations. This insulating layer suffers of an electron trapping that is mitigated after the rapid thermal annealing (RTA). The RTA improved also the permittivity (up to 6ε0), although the negative fixed charge remains in the order of 1012cm-2. However, the temperature dependent electrical investigation of the MOS capacitors demonstrates that the room temperature Fowler-Nordheim electron barrier height of 2.37 eV lies between the values expected for SiO2/4H-SiC and Al2O3/4H-SiC systems.

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