arXivDaily arXiv每日学术速递 周一至周五更新
arXiv 2005.05185physics.app-phcond-mat.mtrl-sci
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用于可调谐光电和等离子体激元器件的在CMOS兼容温度下沉积的过渡金属氮化物薄膜

Transition metal nitride thin films deposited at CMOS compatible temperatures for tunable optoelectronic and plasmonic devices

Ryan Bower, Daniel A. L. Loch, Andrey Berenov, Bin Zou, Papken Eh. Hovsepian, Arutiun P. Ehiasarian, Peter K. Petrov

摘要:

过渡金属氮化物在等离子体和光电子器件中的应用受到了极大的关注。然而,沉积温度仍然是将过渡金属氮化物作为等离子体材料集成在CMOS制造工艺内的重要障碍。采用高功率脉冲磁控溅射法(HIPIMS)制备了以氮化钛和氮化铌为基体的二元、三元和层状过渡金属氮化物薄膜。在HIPIMS工艺中实现的增加的等离子体密度允许在小于300°C的CMOS兼容温度下沉积高质量等离子体薄膜。薄膜被沉积在一系列工业相关的衬底上,并在紫外到可见光谱范围内显示可调谐的等离子体频率。薄膜质量与沉积工艺的可扩展性相结合,表明氮化物膜的HIPIMS沉积是工业上可行的技术,并且可以为下一代等离子体和光电子器件的制造铺平道路。

英文摘要:

Transition metal nitrides have received significant interest for use within plasmonic and optoelectronic devices. However, deposition temperature remains a significant barrier to the integration of transition metal nitrides as plasmonic materials within CMOS fabrication processes. Binary, ternary and layered transition metal nitride thin films based on titanium and niobium nitride are deposited using High Power Impulse Magnetron Sputtering (HIPIMS). The increased plasma densities achieved in the HIPIMS process allow high quality plasmonic thin films to be deposited at CMOS compatible temperatures of less than 300°C. Thin films are deposited on a range of industrially relevant substrates and display tunable plasma frequencies in the ultraviolet to visible spectral ranges. The thin film quality, combined with the scalability of the deposition process, indicates that HIPIMS deposition of nitride films is an industrially viable technique and can pave the way towards the fabrication of next generation plasmonic and optoelectronic devices.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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