The development of an innovative position sensitive pixelated sensor to detect and measure with high precision the coordinates of the ionizing particles is proposed. The silicon avalanche pixel sensors (APiX) is based on the vertical integration of avalanche pixels connected in pairs and operated in coincidence in fully digital mode and with the processing electronics embedded on the chip. The APiX sensor addresses the need to minimize the material budget and related multiple scattering effects in tracking systems requiring a high spatial resolution in the presence of a large occupancy. The expected operation of the new sensor features: low noise, low power consumption and suitable radiation tolerance. The APiX device provides on-chip digital information on the position of the coordinate of the impinging charged particle and can be seen as the building block of a modular system of pixelated arrays, implementing a sparsified readout. The technological challenges are the 3D integration of the device under CMOS processes and integration of processing electronics.
We present the design, construction, and performance of a facility for the characterization of Silicon Avalanche Photodiodes in the operating temperature range between -2 $^\circ$C and 25 $^\circ$C. The system can simultaneously measure up to 24 photo-detectors, in a completely automatic way, within one day of operations. The measured data for each sensor are: the internal gain as a function of the bias voltage and temperature, the gain variation with respect to the bias voltage, and the dark current as a function of the gain. The systematic uncertainties have been evaluated during the commiss…
The avalanche breakdown and Geiger mode of the silicon p-n junction is considered. A precise physically motivated method is proposed for determining the avalanche breakdown voltage of silicon photomultipliers (Si PM). The method is based on measuring the dependence of the relative photon detection efficiency (PDErel ) on the bias voltage when one type of carriers (electron or hole) is injected into the avalanche multiplication zone of the p-n junction. The injection of electrons or holes from the base region of the Si PM semiconductor structure is performed using short-wave or long-wave light.…
4H-Silicon Carbide, when considered as a material for the fabrication of Low Gain Avalanche Detectors for particle timing and position measurement, offers potential advantages over Silicon. We discuss an ongoing study of this material aimed at the fabrication and test of prototype fast timing sensors. This work is well aligned with technical directions identified in the recent Department of Energy study, Basic Research Needs for High Energy Physics Detector Research and Development.
We report on the characterization of the response of windowless silicon avalanche photo-diodes to electrons in the 90-900 eV energy range. The electrons were provided by a monoenergetic electron gun present in the LASEC laboratories of University of Roma Tre. We find that the avalanche photo-diode generates a current proportional to the current of electrons hitting its active surface. The gain is found to depend on the electron energy $E_e$, and varies from $2.147 \pm 0.027$ (for $E_e = 90$ eV) to $385.8 \pm 3.3$ (for $E_e = 900$ eV), when operating the diode at a bias of $V_{apd} = 350$ V.} T…
The development of Low-Gain Avalanche Detectors has opened up the possibility of manufacturing silicon detectors with signal larger than that of traditional sensors. In this paper we explore the timing performance of Low-Gain Avalanche Detectors, and in particular we demonstrate the possibility of obtaining ultra-fast silicon detector with time resolution of less than 20 picosecond.
We demonstrate an efficient photon number detector for visible wavelengths using a silicon avalanche photodiode. Under subnanosecond gating, the device is able to resolve up to four photons in an incident optical pulse. The detection efficiency at 600 nm is measured to be 73.8%, corresponding to an avalanche probability of 91.1% of the absorbed photons, with a dark count probability below 1.1x10^{-6} per gate. With this performance and operation close to room temperature, fast-gated silicon avalanche photodiodes are ideal for optical quantum information processing that requires single-shot pho…
Review of germanium-silicon single-photon avalanche diodes
Artilux Inc.（Artlux公司）；Institute of Photonics and Quantum Sciences, Heriot-Watt University（赫瑞-瓦特大学光子与量子科学研究所）；James Watt School of Engineering, University of Glasgow（格拉斯哥大学詹姆斯·瓦特工程学院）；Department of Engineering, University of Massachusetts, Boston（马萨诸塞大学波士顿分校工程系）
Silicon avalanche photodiodes (APDs) are sensitive to operating temperature fluctuations and are also susceptible to radiation flux expected in satellite-based quantum experiments. We introduce a low power voltage adjusting mechanism to overcome the effects of in-orbit temperature fluctuations. We also present data on the performance of Si APDs after irradiation (gamma-ray and proton beam). Combined with an analysis of expected orbital irradiation, we propose that a Si APD in a 400 km equatorial orbit may operate beyond the lifetime of the satellite.
The Microhexcavity Panel ( muHex) is a novel gaseous micropattern particle detector comprised of a dense array of close-packed hexagonal pixels, each operating as an independent detection unit for ionizing radiation. It is a second generation detector derived from plasma panel detectors and microcavity detectors. The muHex is under development to be deployed as a scalable, fast timing (ns) and hermetically sealed gaseous tracking detector with high rate ( > 100 KHz/cm^2 ) capability. The devices reported here were fabricated as 16 x 16 pixel arrays of 2 mm edge-to-edge, 1 mm deep hexagonal cel…
In this paper I want to review the current status of development of multi-pixel silicon-based avalanche photo-diodes operated in Geiger mode, also known as Silicon Photomultipliers (SiPM). Particular emphasis is given to the application of this type of photo-sensors in high energy physics detectors.
Silicon single-photon avalanche diode (SPAD) is a core device for single-photon detection in the visible and the near-infrared range, and widely used in many applications. However, due to limits of the structure design and device fabrication for current silicon SPADs, the key parameters of detection befficiency and timing jitter are often forced to compromise. Here, we propose a nanostructured silicon SPAD, which achieves high detection efficiency with excellent timing jitter simultaneously over a broad spectral range. The optical and electric simulations show significant performance enhanceme…
We present characterization results of two silicon photomultipliers; the Hamamatsu LVR-6050-CN and the Ketek PM3325 WB. With our measurements of the bias dependence of the breakdown probability we are able to draw conclusions about the location and spatial extension of the avalanche region. For the KETEK SiPM we find that the avalanche region is located close to the surface. In the Hamamatsu SiPM the high-field region is located $0.5\,μ$m below the surface, while the volume above is depleted almost until the surface. Furthermore, for the Hamamatsu SiPM we find that charge carriers produced by …
Silicon sensors with high time resolution can help particle identification in the International Linear Collider (ILC). We are studying Low Gain Avalanche Diodes (LGADs) as a high timing resolution sensor. As a step to develop LGADs, we are now focusing to characterize Avalanche Photo Diode (APD)s, because the APDs has the same multiplication structure as LGADs. We studied the characteristics of APDs with particles from radioisotopes.
Hamamatsu Photonics introduced a new generation of their Multi-Pixel Photon Counters in 2013 with significantly reduced after-pulsing rate. In this paper, we investigate the causes of after-pulsing by testing pre-2013 and post-2013 devices using laser light ranging from 405 to 820nm. Doing so we investigate the possibility that afterpulsing is also due to optical photons produced in the avalanche rather than to impurities trapping charged carriers produced in the avalanches and releasing them at a later time. For pre-2013 devices, we observe avalanches delayed by ns to several 100~ns at 637, 7…
The results of a development of a scintillator counter with wavelength shifting (WLS) fibre and a multi-pixel Geiger-mode avalanche photodiode readout are presented. The photodiode has a metal-resistor-semiconductor layered structure and operates in the limited Geiger mode. The scintillator counter has been developed for the EMMA underground cosmic ray experiment.
The Tokai-to-Kamioka (T2K) experiment is a second generation long baseline neutrino oscillation experiment which aims at a sensitive search for the nu_e appearance. The main design features of the T2K near detectors located at 280 m from the target are presented. Scintillator counters developed for the T2K near detectors are described. Readout of the counters is provided via WLS fibers embedded into S-shape grooves in a scintillator and viewed from both ends by multi-pixel avalanche photodiodes operating in a limited Geiger mode. A desription, operational principles and the results of tests of…
To measure light emission pattern in scintillator, higher sensitivity and faster response are required to photo detector. Such as single photon avalanche diode (SPAD), conventional pixelated photo detector is operated at Geiger avalanche multiplication. However higher gain of SPAD seems very attractive, photon detection efficiency per unit area is low. This weak point is mainly caused by Geiger avalanche mechanism. To overcome these difficulties, we designed Pixelated Linear Avalanche Integration Detector using Silicon on Insulator technology (SOI-Plaid). To avoid dark count noise and dead tim…
The photon detection efficiencies of multi-pixel Geiger-mode avalanche photodiodes manufactured by different produ cers are estimated. A new fit method of the response spectra to low-intensity light, taking into ac count after-pulse and cross-talk effects is proposed to yield the initial number of photons. The value of photon detection efficiency is calculated using a calibrated photodetector as a reference.
Integrated quantum photonics, which allows for the development and implementation of chip-scale devices, is recognized as a key enabling technology on the road towards scalable quantum networking schemes. However, many state-of-the-art integrated quantum photonics demonstrations still require the coupling of light to external photodetectors. On-chip silicon single-photon avalanche diodes (SPADs) provide a viable solution as they can be seamlessly integrated with photonic components, and operated with high efficiencies and low dark counts at temperatures achievable with thermoelectric cooling. …
A systematic experimental study of the main challenges for silicon-pixel sensors at the European XFEL is presented. The high instantaneous density of X-rays and the high repetition rate of the XFEL pulses result in signal distortions due to the plasma effect and in severe radiation damage. The main parameters of X-ray-radiation damage have been determined and their impact on p+n sensors investigated. These studies form the basis of the optimized design of a pixel-sensor for experimentation at the European XFEL.
PIXELATED geiger-mode avalanche photodiodes(PPDs), often called silicon photomultipliers (SiPMs) are emerging as an excellent replacement for traditional photomultiplier tubes (PMTs) in a variety of detectors, especially those for subatomic physics experiments, which requires extensive test and operation procedures in order to achieve uniform responses from all the devices. In this paper, we show for two PPD brands, Hamamatsu MPPC and SensL SPM, that the dark noise rate, breakdown voltage and rate of correlated avalanches can be inferred from the sole measure of dark current as a function of o…
Hybrid silicon pixel detectors are currently used in the innermost tracking system of the Compact Muon Solenoid (CMS) experiment. Radiation tolerance up to fluences expected for a few years of running of the Large Hadron Collider (LHC) has already been proved, although some degradation of the part of the silicon detector closer to the interaction point is expected. During the LHC upgrade phases, the level of dose foreseen for the silicon pixel detector will be much higher. To face this aspect, dedicated irradiation tests with fluences above $\mathcal{O}(10^{15})$ n$_{\textrm{eq}}$/cm$^2$ have …
A near-infrared (NIR) enhanced silicon single-photon avalanche diode (SPAD) fabricated in a customized 0.13 $μ$m CMOS technology is presented. The SPAD has a depleted absorption volume of approximately 15 $μ$m x 15 $μ$m x 18 $μ$m. Electrons generated in the absorption region are efficiently transported by drift to a central active avalanche region with a diameter of 2 $μ$m. At the operating voltage, the active region contains a spherically uniform field peak, enabling the multiplication of electrons originating from all corners of the device. The advantages of the SPAD architecture include hig…
The inner drift chamber of the BESIII is encountering serious aging problem after five year's running. For the first layer, the decrease in gas gain is about 26% from 2009 to 2013. The upgrade of the inner tracking detector has become an urgent problem for the BESIII experiment. An inner tracker using CMOS pixel sensors is an important candidate because of its great advantages on spatial resolution and radiation hardness. In order to carry out a Monte Carlo study on the expected performance, a Geant4-based full simulation for the silicon pixel detector has been implemented. The tracking method…
It is well known that avalanche photodiodes operated in the Geiger mode above the breakdown voltage offer a virtually infinite sensitivity and time accuracy in the picosecond range that can be used for single photon detection. However, their performance in particle detection remains still unexplored. In this contribution, we are going to expose the different steps that we have taken in order to prove the efficiency of Geiger mode avalanche photodiodes in the aforementioned field. In particular, we will present an array of pixels of 1mmx1mm fabricated with a standard CMOS technology for charact…
High-energy physics detectors, like Low Gain Avalanche Detectors (LGADs) that will be used as fast timing detectors in the High Luminosity LHC experiments, have to exhibit a significant radiation tolerance. Thereby the impact of radiation on the highly boron-doped gain layer that enables the internal charge multiplication, is of special interest, since due to the so-called Acceptor Removal Effect (ARE) a radiation-induced deactivation of active boron dopants takes place. In this paper we present defect-spectroscopy measurements (Deep-Level Transient Spectroscopy and Thermally Stimulated Curren…
Design and physical operation principles of new microchannel avalanche photodiode (MC APD) with gain up to 10^5 and linearity range improved an order of magnitude compared to known similar devices. A distinctive feature of the new device is a directly biased p-n junction under each pixel which plays role of an individual quenching resistor. This allows increasing pixel density up to 40000 per mm^2 and making entire device area sensitive.
In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate to achieve a large area instrumented with pixel sensors, since it is radiation hard and cost effective. The paper reports on the performance of novel n-on-p edgeless planar pixel sensors produced by FBK-CMM, making use of the active trench for the reduction of the dead area at the periphery of the device. After discussing the sensor technology an overview of the first beam test res…
The proof-of-concept prototype of the Picosecond Avalanche Detector, a multi-PN junction monolithic silicon detector with continuous gain layer deep in the sensor depleted region, was tested with a beam of 180 GeV pions at the CERN SPS. The prototype features low noise and fast SiGe BiCMOS frontend electronics and hexagonal pixels with 100 μm pitch. At a sensor bias voltage of 125 V, the detector provides full efficiency and average time resolution of 30, 25 and 17 ps in the overall pixel area for a power consumption of 0.4, 0.9 and 2.7 W/cm^2, respectively. In this first prototype the time re…
In this paper the results of a beam test characterization campaign of 3D trench silicon pixel sensors are presented. A time resolution in the order of 10 ps was measured both for non-irradiated and irradiated sensors up to a fluence of $2.5 \cdot 10^{16}\,1\,MeV\, n_{eq}\,cm^{-2}$. This feature and a detection efficiency close to $99\%$ make this sensors one of the best candidates for 4D tracking detectors in High-Energy-Physics experiments.
Integrated photodetectors are essential components of scalable photonics platforms for quantum and classical applications. However, most efforts in the development of such devices to date have been focused on infrared telecommunications wavelengths. Here, we report the first monolithically integrated avalanche photodetector (APD) for visible light. Our devices are based on a doped silicon rib waveguide with a novel end-fire input coupling to a silicon nitride waveguide. We demonstrate a high gain-bandwidth product of 216 $\pm$ 12 GHz at 20 V reverse bias measured for 685 nm input light, with a…
In view of the LHC upgrade phases towards HL-LHC, the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness, that allow for enlarging the area instrumented with pixel detectors. We report on the development of novel n-in-p edgeless planar pixel sensors fabricated at FBK (Trento, Italy), making use of the "active edge" concept for the reduction of the dead area at the periphery of the device. After discussing the sensor technology and fa…
The Silicon Photomultiplier (SiPM) is a mature photodetector concept that is applied in a variety of applications ranging from medical imaging to automotive LiDAR systems. Over the last few years, improvements of the sensor performance are gradually approaching to a saturation. In this work we present our new concept to overcome the intrinsic limitations of planar configurations of electrodes. Our non-planar technology is based on focusing and enhancing the electric fields by tip-like electrodes. The shape of the electric field and the lack of typical micro-cell edges, allows us to exclude cel…
Silicon Carbide device (4H-SiC) has potential radiation hardness, high saturated carrier velocity and low temperature sensitivity theoretically. The Silicon Low Gain Avalanche Diode (LGAD) has been verified to have excellent time performance. Therefore, the 4H-SiC LGAD is introduced in this work for application to detect the Minimum Ionization Particles (MIPs). We provide guidance to determine the thickness and doping level of the gain layer after an analytical analysis. The gain layer thickness $d_{gain}=0.5~μm$ is adopted in our design. We design two different types of 4H-SiC LGAD which have…
An approximate iterative model of avalanche process in a pixel of micropixel avalanche photodiode initiated by a single photoelectron is presented. The model describes development of the avalanche process in time, taking into account change of electric field within the depleted region caused by internal discharge and external recharge currents. Conclusions obtained as a result of modelling are compared with experimental data. Simulations show that typical durations of the front and rear edges of the discharge current have the same magnitude of less than 50 ps. The front of the external recharg…
Using the simulation framework of the SiD detector to study the Higgs -> mumu decay channel showed a considerable gain in signal significance could be achieved through an increase in charged particle momentum resolution. However more detailed simulations of theZ -> mumu decay channel demonstrated that significant improvement in the resolution could not be achieved through an increase in tracker granularity. Conversely detector stability studies into missing/dead vertex layers using longer lived particles displayed an increase in track resolution. The existing 9.15 cm x 25 μm silicon strip geom…
Recent years getting progress in the area of micropixel avalanche photodiode makes them attractive as sensors for scintillation detectors. The performance of the scintillation detectors is strongly tied to the physical properties of MAPD. For this point of wives, we will investigate three types MAPD-3NK, MAPD-3NM and MAPD-3NM-II for possible use in a scintillation detector. Investigated avalanche photodiodes have the following parameters e.g low operation voltage (90V$<$U$<$50V), high pixel density (4000 pixel/mm^2), high photodetection efficiency (40%) and high gain (6*10^4). Gamma-ray detect…
Planar silicon pixel sensors with modified n$^+$-implantation shapes based on the IBL pixel sensor were designed in Dortmund. The sensors with a pixel size of $250\,μ$m $\times$ $50\,μ$m are produced in n$^+$-in-n sensor technology. The charge collection efficiency should improve with electrical field strength maxima created by the different n$^+$-implantation shapes. Therefore, higher particle detection efficiencies at lower bias voltages could be achieved. The modified pixel designs and the IBL standard design are placed on one sensor to test and compare the designs. The sensor can be read o…
The basic principle of operation of silicon sensors with resistive read-out is built-in charge sharing. Resistive Silicon Detectors (RSD, also known as AC-LGAD), exploiting the signals seen on the electrodes surrounding the impact point, achieve excellent space and time resolutions even with very large pixels. In this paper, a TCT system using a 1064 nm picosecond laser is used to characterize sensors from the second RSD production at the Fondazione Bruno Kessler. The paper first introduces the parametrization of the errors in the determination of the position and time coordinates in RSD, then…
Initial performance assessment and calibration techniques of the production monolithic silicon pixel detector ASIC for the detection of electromagnetic showers of TeV energy in the FASER experiment at the LHC
A study of 3D pixel sensors of cell size 50 μm x 50 μm fabricated at IMB-CNM using double-sided n-on-p 3D technology is presented. Sensors were bump-bonded to the ROC4SENS readout chip. For the first time in such a small-pitch hybrid assembly, the sensor response to ionizing radiation in a test beam of 5.6 GeV electrons was studied. Results for non-irradiated sensors are presented, including efficiency, charge sharing, signal-to-noise, and resolution for different incidence angles.
This paper describes the historical evolution of silicon detectors from simple strip configurations to hybrid pixel detectors for high energy physics applications. This development has been critical to maintain the necessary physics performance in the high-rate and highdensity environment of the LHC. The importance of pixel detectors and their evolution for future projects and other fields is also described.
We show that doubly peaked electric fields are necessary to describe grazing-angle charge collection measurements of irradiated silicon pixel sensors. A model of irradiated silicon based upon two defect levels with opposite charge states and the trapping of charge carriers can be tuned to produce a good description of the measured charge collection profiles in the fluence range from 0.5x10^{14} Neq/cm^2 to 5.9x10^{14} Neq/cm^2. The model correctly predicts the variation in the profiles as the temperature is changed from -10C to -25C. The measured charge collection profiles are inconsistent wit…
Nowadays, numerous fields such as High Energy Physics (HEP), medical imaging devices, portable radiation detectors etc., require a robust, miniature, reliable and readily available photon detector that is stable in a variety of environments, such as the presence of strong magnetic fields. The recently available $\sim$1mm$^{\textrm{2}}$ active area Multi-pixel Photon Counter (MPPC) sensors, produced by Hamamatsu Photonics, have been found to be reliable and an attractive choice for the HEP applications. The following sensor characteristics have been thoroughly tested by T2K collaboration: gain,…
In this paper we discuss the measurement of charge collection in irradiated silicon pixel sensors and the comparison with a detailed simulation. The simulation implements a model of radiation damage by including two defect levels with opposite charge states and trapping of charge carriers. The modeling proves that a doubly peaked electric field generated by the two defect levels is necessary to describe the data and excludes a description based on acceptor defects uniformly distributed across the sensor bulk. In addition, the dependence of trap concentrations upon fluence is established by com…
In this paper, we describe the development of monolithic pixel detectors by using a Silicon-on-Insulator (SOI) technology for X-ray and charged particle applications. The detectors are based on a 0.2 μm CMOS fully depleted SOI process (Lapis Semiconductor Co., Ltd). The SOI wafer consists of a thick high-resistivity substrate for sensing and a thin low resistivity Si layer for CMOS circuits. We developed the integration-type SOI pixel detector, INTPIX4 mainly for X-ray imaging; it is made of a Float Zone (FZ) or Czochralski (Cz) silicon wafer. Since 2005, Cz SOI detectors were used initially. …
A silicon pixel detector with fine pitch size of 19x19 um, developed base on SOI (silicon on insulator) technology, was tested under the illumination of infrared laser pulses. As an alternative way to particle beam tests, the laser pulses were tuned to very short duration and small transverse profile to simulate the tracks of MIPs (minimum ionization particles) in silicon. Hit cluster sizes were measured with focused laser pulses propagating through the SOI detector perpendicular to its surface and most of the induced charge was found to be collected inside the seed pixel. For the first time, …
Pixel detectors are used in the innermost part of multi purpose experiments at the Large Hadron Collider (LHC) and are therefore exposed to the highest fluences of ionising radiation, which in this part of the detectors consists mainly of charged pions. The radiation hardness of the detectors has thoroughly been tested up to the fluences expected at the LHC. In case of an LHC upgrade the fluence will be much higher and it is not yet clear up to which radii the present pixel technology can be used. In order to establish such a limit, pixel sensors of the size of one CMS pixel readout chip (PSI4…
The CLIC Tracker Detector (CLICTD) is a monolithic pixelated sensor chip produced in a $180$ nm imaging CMOS process built on a high-resistivity epitaxial layer. The chip, designed in the context of the CLIC tracking detector study, comprises a matrix of ${16\times128}$ elongated pixels, each measuring ${300\times30}$ $μ$m$^2$. To ensure prompt charge collection, every elongated pixel is segmented in eight sub-pixels, each containing a collection diode and a separate analog front-end. A simultaneous $8$-bit time measurement with $10$ ns time bins and $5$-bit energy measurement with programmabl…
Spectroscopy of Earth-like exoplanets and ultra-faint galaxies are priority science cases for the coming decades. Here, broadband source flux rates are measured in photons per square meter per hour, imposing extreme demands on detector performance, including dark currents lower than 1 e-/pixel/kilosecond, read noise less than 1 e-/pixel/frame, and large formats. There are currently no infrared detectors that meet these requirements. The University of Hawaii and industrial partners are developing one promising technology, linear mode avalanche photodiodes (LmAPDs), using fine control over the H…
Resistive AC-coupled Silicon Detectors (RSDs) are based on the Low Gain Avalanche Diode (LGAD) technology, characterized by a continuous gain layer, and by the innovative introduction of resistive read-out. Thanks to a novel electrode design aimed at maximizing signal sharing, RSD2, the second RSD production by Fondazione Bruno Kessler (FBK), achieves a position resolution on the whole pixel surface of about 8 $μm$ for 200-$μm$ pitch. RSD2 arrays have been tested using a Transient Current Technique setup equipped with a 16-channel digitizer, and results on spatial resolution have been obtained…
