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arXiv 1101.4576cond-mat.mes-hall
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用于原位结制作的电子束光刻新技术:可控底切

Novel E-beam lithography technique for in-situ junction fabrication: the controlled undercut

Florent Lecocq, Cécile Naud, Ioan M. Pop, Zhi-Hui Peng, Iulian Matei, Thierry Crozes, Thierry Fournier, Wiebke Guichard, Olivier Buisson

摘要:

我们提出了一种新的阴影蒸发技术实现的结和电容器。通过电子束光刻在双层抗蚀剂上设计强非对称底切,使得能够在不使用众所周知的悬桥的情况下原位制造结和电容器[1]。桥的存在增加了抗蚀剂掩模的机械鲁棒性以及从0.01到大于10000平方微米的结尺寸的可访问范围。我们用100 kV电子束写入器制备了Al/AlOx/Al约瑟夫森结、相位量子位和电容。虽然这种高电压能够精确控制底切,但也讨论了使用传统的20 kV电子束的实施。从光谱共振宽度,拉比和拉姆齐振荡衰减和能量弛豫测量中提取的相位量子比特相干时间比我们以前通过标准技术实现的样品中获得的时间长。这些结果表明,通过这种控制的底切技术获得的结的高质量。

英文摘要:

We present a novel shadow evaporation technique for the realization of junctions and capacitors. The design by E-beam lithography of strongly asymmetric undercuts on a bilayer resist enables in-situ fabrication of junctions and capacitors without the use of the well-known suspended bridge[1]. The absence of bridges increases the mechanical robustness of the resist mask as well as the accessible range of the junction size, from 0.01 to more than 10000 micron square. We have fabricated Al/AlOx/Al Josephson junctions, phase qubit and capacitors using a 100kV E- beam writer. Although this high voltage enables a precise control of the undercut, implementation using a conventional 20kV E-beam is also discussed. The phase qubit coherence times, extracted from spectroscopy resonance width, Rabi and Ramsey oscillations decay and energy relaxation measurements, are longer than the ones obtained in our previous samples realized by standard techniques. These results demonstrate the high quality of the junction obtained by this controlled undercut technique.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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