直接laser写入法在三维形貌上制备超导隧道结
Superconducting tunnel junction fabrication on three-dimensional topography via direct laser writing
摘要：
超导结广泛应用于从量子信息科学和传感到固态冷却的众多应用中。传统上，此类器件必须使用标准光刻技术在平坦衬底上制造。在这项研究中，我们展示了一个高度通用的方法，允许超导结上制造一个更复杂的地形。它基于无掩模直接激光写入（DLW）双光子光刻，允许在3D空间中写入。我们表明，高品质的正常金属-绝缘体-超导体（NIS）隧道结可以制作在一个20 $μ$ m高的三维地形顶部。结合更先进的抗蚀剂涂层方法，这种技术可以允许亚微米器件制造几乎任何类型的地形在未来。
英文摘要：
Superconducting junctions are widely used in multitude of applications ranging from quantum information science and sensing to solid-state cooling. Traditionally, such devices must be fabricated on flat substrates using standard lithographic techniques. In this study, we demonstrate a highly versatile method that allows for superconducting junctions to be fabricated on a more complex topography. It is based on maskless direct laser writing (DLW) two-photon lithography, which allows writing in 3D space. We show that high-quality normal metal-insulator-superconductor (NIS) tunnel junctions can be fabricated on top of a 20 $μ$m tall three-dimensional topography. Combined with more advanced resist coating methods, this technique could allow sub-micron device fabrication on almost any type of topography in the future.
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