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arXiv physics/0407094physics.atom-ph
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现实世界中的原子芯片:金属丝的影响

Atom chips in the real world: the effects of wire corrugation

Thorsten Schumm, Jèrôme Estève, Christine Aussibal, Cristina Figl, Jean-Baptiste Trebbia, Hai Nguyen, Dominique Mailly, Isabelle Bouchoule, Christopher Westbrook, Alain Aspect

摘要:

我们提出了一个详细的模型,描述的影响,线上的捕获潜力所经历的云的原子载流微线。我们计算的电流分布的失真,由于电子束,然后推导出相应的粗糙度的磁场以上的导线。标度法推导出的粗糙度作为一个功能的高度以上的带状线。我们还提出了使用冷原子的微丝陷阱的实验数据,补充了一些以前发表的测量结果,并表明,线的碎片可以令人满意地解释我们的观察原子云碎片以上电镀金线。最后,我们提出了测量的电子束光刻和蒸发的金制造的新导线的电阻率。这些线看起来比电镀线基本上更光滑。

英文摘要:

We present a detailed model describing the effects of wire corrugation on the trapping potential experienced by a cloud of atoms above a current carrying micro wire. We calculate the distortion of the current distribution due to corrugation and then derive the corresponding roughness in the magnetic field above the wire. Scaling laws are derived for the roughness as a function of height above a ribbon shaped wire. We also present experimental data on micro wire traps using cold atoms which complement some previously published measurements and which demonstrate that wire corrugation can satisfactorily explain our observations of atom cloud fragmentation above electroplated gold wires. Finally, we present measurements of the corrugation of new wires fabricated by electron beam lithography and evaporation of gold. These wires appear to be substantially smoother than electroplated wires.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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