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arXiv 2007.02368cond-mat.mtrl-scicond-mat.other
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拓扑材料实现室温电输运应用的判据

Criteria for realizing room temperature electrical transport applications of topological materials

Matthew Brahlek

摘要:

拓扑材料中发现的不寻常的电子状态可以实现新一代的器件和技术,但长期以来的挑战是找到没有有害的平行体导电的材料。这可能是由缺陷或热激活载体引起的。在这里,我澄清的标准,材料需要满足实现由拓扑状态,拓扑设备的必要性为主的输运性质。这是证明了三维拓扑绝缘体,三维狄拉克材料,和一维量子反常霍尔绝缘体,虽然这可以适用于类似的系统。关键参数是电子带隙、介电常数和载流子有效质量,它们决定了在什么情况下(缺陷密度、温度等)不需要的体状态将与拓扑状态并行地传导。由于这些基本上是由基本的原子性质决定的,因此可以使用简单的化学参数来导航相空间,以最终找到改进的材料。这将能够快速识别具有改进性能的新系统,这对于设计新材料系统和推动新一代拓扑技术至关重要。

英文摘要:

The unusual electronic states found in topological materials can enable a new generation of devices and technologies, yet a long-standing challenge has been finding materials without deleterious parallel bulk conduction. This can arise either from defects or thermally activated carriers. Here, I clarify the criteria that materials need to meet to realize transport properties dominated by the topological states, a necessity for a topological device. This is demonstrated for 3-dimensional topological insulators, 3D Dirac materials, and 1D quantum anomalous Hall insulators, though this can be applied to similar systems. The key parameters are electronic band gap, dielectric constant, and carrier effective mass, which dictate under what circumstances (defect density, temperature, etc.) the unwanted bulk state will conduct in parallel to the topological states. As these are fundamentally determined by the basic atomic properties, simple chemical arguments can be used to navigate the phase space to ultimately find improved materials. This will enable rapid identification of new systems with improved properties, which is crucial to design new materials systems and push into a new generation of topological technologies.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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