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arXiv 2608.13830cond-mat.mtrl-sci

基于高功率因数NiFe合金的人工倾斜多层膜在室温下实现创纪录的横向热电优值

Realizing record-high transverse thermoelectric figure of merit at room temperature in artificially tilted multilayers based on high power factor NiFe alloy

Yebin Lee, Fuyuki Ando, Takamasa Hirai, Keisuke Hirata, Kota Hasegawa, Ken-ichi Uchida

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中文总结 AI 辅助

该研究基于高功率因数NiFe合金设计人工倾斜多层膜,在室温无外磁场下实现创纪录的横向热电优值zᵧₓT=0.36,为室温横向热电材料的实用化奠定基础。

中文摘要 AI 辅助

人工倾斜多层膜(ATMLs)的横向热电转换提供了一种通用的器件架构,规避了传统纵向热电材料的结构限制,但在无外磁场条件下实现有竞争力的室温热电性能仍是关键挑战。本文报道了基于Ni₅₀Fe₅₀/Bi₀.₂Sb₁.₈Te₃的ATML在室温下、无外磁场时达到创纪录的横向热电优值zᵧₓT为0.36。利用Ni₅₀Fe₅₀合金的纵向高功率因子,以及n型Ni₅₀Fe₅₀与p型Bi₀.₂Sb₁.₈Te₃之间电、热输运性质的显著差异,设计了各向异性结构,同时利用高电导率、大横向热电势和低热导率来最大化ATML的zᵧₓT。通过对这些热电输运参数的直接测量,在基于Ni₅₀Fe₅₀/Bi₀.₂Sb₁.₈Te₃的ATML中得到zᵧₓT为0.36,该结果与分析预测的0.36高度吻合,归因于Ni₅₀Fe₅₀/Bi₀.₂Sb₁.₈Te₃结处的低界面电、热阻。这些结果为室温附近横向热电材料的实际应用铺平了道路。

英文摘要

Transverse thermoelectric conversion using artificially tilted multilayers (ATMLs) offers a versatile device architecture that circumvents the structural limitations of conventional longitudinal thermoelectrics. However, achieving competitive room-temperature thermoelectric performance without an external magnetic field remains a critical challenge. Here, we report a record-high transverse thermoelectric figure of merit $z_{yx}T$ of 0.36 in Ni$_{50}$Fe$_{50}$/Bi$_{0.2}$Sb$_{1.8}$Te$_{3}$-based ATML at room temperature without an external magnetic field. Leveraging the longitudinal high power factor in a Ni$_{50}$Fe$_{50}$ alloy and the sharp contrast in electrical and thermal transport properties between $n$-type Ni$_{50}$Fe$_{50}$ and $p$-type Bi$_{0.2}$Sb$_{1.8}$Te$_{3}$, we engineer an anisotropic structure that simultaneously exploits high electrical conductivity, large transverse thermopower, and low thermal conductivity to maximize $z_{yx}T$ in ATML. Through the direct measurements of these thermoelectric transport parameters, we obtained $z_{yx}T$ of 0.36 in Ni$_{50}$Fe$_{50}$/Bi$_{0.2}$Sb$_{1.8}$Te$_{3}$-based ATML, which is in excellent agreement with the analytical prediction of 0.36 owing to the low interfacial electrical and thermal resistances at the Ni$_{50}$Fe$_{50}$/Bi$_{0.2}$Sb$_{1.8}$Te$_{3}$ junctions. These results pave the way for the practical implementation of transverse thermoelectric materials around room temperature.

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