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arXiv 1911.10285physics.ins-dethep-ex
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低温下电子元器件的可靠性研究

Reliability studies of electronic components for the operation at cryogenic temperature

N. Poonthottathil, F. Krennrich, J. Eisch, A. Weinstein, L. J Bond, D. Barnard, Z. Zhang, L Koester

摘要:

冷电子学是许多科学和技术领域的关键技术,包括空间探索计划和粒子物理学。下一代中微子实验是一个在低温下运行的具有大量模拟和数字电子信号处理通道的主要实验,即深地下中微子实验(DUNE)。DUNE探测器使用87 K的液态氩作为中微子的靶材料,并作为介质来跟踪探测器体积中相互作用产生的带电粒子。DUNE电子产品[1]由基于低功耗180 nm-CMOS技术定制设计的ASIC(专用集成电路)芯片组成。该技术的主要风险是电子元件将在液体氩气中浸泡多年(20-30年)而无法进入。ASIC的可靠性问题可能来自于热应力、封装和制造相关的缺陷:如果未被发现,这些可能会导致长期的可靠性和性能问题。本文的范围是探索非破坏性的评估技术,其潜在的使用在一个全面的质量控制过程中的原型,测试和调试的DUNE冷电子系统。具体来说,我们已经使用了扫描声学显微镜和X射线断层扫描来研究与室温和低温之间的热循环相关的ASIC芯片中的永久性结构变化。

英文摘要:

Cold electronics is a key technology in many areas of science and technology including space exploration programs and particle physics. A major experiment with a very large number of analog and digital electronics signal processing channels to be operated at cryogenic temperatures is the next-generation neutrino experiment, the Deep Underground Neutrino Experiment (DUNE). The DUNE detector uses liquid Argon at 87K as a target material for neutrinos, and as a medium to track charged particles resulting from interactions in the detector volume. The DUNE electronics [1] consists of custom-designed ASIC (Application Specific Integrated Circuits) chips based on low power 180 nm-CMOS technology. The main risk for this technology is that the electronics components will be immersed in liquid argon for many years (20-30 years) without access. Reliability issues of ASICs may arise from thermal stress, packaging, and manufacturing-related defects: if undetected those could lead to long-term reliability and performance problems. The scope of this paper is to explore non-destructive evaluation techniques for their potential use in a comprehensive quality control process during prototyping, testing and commissioning of the DUNE cold electronics system. Specifically, we have used the Scanning Acoustic Microscopy and X-ray tomography to study permanent structural changes in the ASIC chips associated with thermal cycling between the room and cryogenic temperatures.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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