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arXiv 1807.08296cond-mat.mtrl-sci
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采用边缘接触的MoS2晶体管的标度抗扰度

Immunity to Scaling in MoS2 Transistors Using Edge Contacts

Zhihui Cheng, Katherine Price, Shreya Singh, Steven Noyce, Yuh-Chen Lin, Yifei Yu, Linyou Cao, Aaron D. Franklin

摘要:

原子级薄的二维(2D)材料由于其薄体厚度而成为亚10 nm晶体管沟道的有希望的候选者,这导致强静电栅极控制。适当地缩放晶体管技术需要减小沟道长度(从源极到漏极的距离)和接触长度(源极和漏极与半导体沟道接口的距离)两者。接触长度缩放仍然是晶体管缩放的未解决的流行病,影响从硅到2D材料的所有半导体器件。在这里,我们表明,清洁的边缘接触到2D二硫化钼提供免疫力的接触缩放问题,与性能是独立的接触长度下降到20纳米制度。使用定向离子束,原位边缘接触的各种金属-二硫化钼界面进行了研究。使用横截面电子显微镜的复杂的边缘接口的表征揭示了不同的形态上的二硫化钼取决于其厚度的影响,从单层到几层膜。发现铬在边缘接触方案中优于其他金属,这归因于较短的Cr-MoS 2键长。与接触长度为20 nm的缩放顶部接触相比,原位边缘接触产生更好的性能,有效接触长度为约1 nm,载流子注入效率高18倍。原位边缘接触还表现出比最佳报告的边缘接触高约8倍的性能。我们的工作为晶体管中接触缩放的解决方案提供了实验证据,使用具有干净边缘接触界面的2D材料,开辟了用2D材料设计器件的新方法。

英文摘要:

Atomically thin two-dimensional (2D) materials are promising candidates for sub-10 nm transistor channels due to their ultrathin body thickness, which results in strong electrostatic gate control. Properly scaling a transistor technology requires reducing both the channel length (distance from source to drain) and the contact length (distance that source and drain interface with semiconducting channel). Contact length scaling remains an unresolved epidemic for transistor scaling, affecting devices from all semiconductors, from silicon to 2D materials. Here, we show that clean edge contacts to 2D MoS2 provide immunity to the contact-scaling problem, with performance that is independent of contact length down to the 20 nm regime. Using a directional ion beam, in situ edge contacts of various metal-MoS2 interfaces are studied. Characterization of the intricate edge interface using cross-sectional electron microscopy reveals distinct morphological effects on the MoS2 depending on its thickness, from monolayer to few-layer films. Chromium is found to outperform other metals in the edge contact scheme, which is attributed to the shorter Cr-MoS2 bond length. Compared to scaled top contacts with 20 nm contact length, in situ edge contacts yield better performance with an effective contact length of ~ 1 nm and 18 times higher carrier injection efficiency. The in situ edge contacts also exhibit ~8 times higher performance compared to the best-reported edge contacts. Our work provides experimental evidence for a solution to contact scaling in transistors, using 2D materials with clean edge contact interfaces, opening a new way of designing devices with 2D materials.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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