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arXiv 1407.0641physics.ins-dethep-ex
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DMAPS:全耗尽单片有源像素传感器-模拟性能表征

DMAPS: a fully depleted monolithic active pixel sensor - analog performance characterization

Miroslav Havránek, Tomasz Hemperek, Hans Krüger, Yunan Fu, Leonard Germic, Tetsuichi Kishishita, Theresa Obermann, Norbert Wermes

摘要:

自20世纪90年代后期以来,已经基于具有薄外延层(厚度为10-15 $μ$ m)的硅衬底开发了单片有源像素传感器(MAPS),其中电荷被收集在电极上,尽管是通过无序和缓慢的扩散,而不是通过定向电场中的漂移。因此,信号很小($\approx$ 1000 e $^-$),并且辐射耐受性远低于LHC要求的100至1000倍。在本文中,我们提出了一个完全耗尽的单片有源像素传感器(DMAPS)的基础上,允许创建一个完全耗尽的检测体积的高电阻率基板的发展。该概念克服了标准MAPS设计中通过扩散进行电荷收集的固有限制。我们目前的测试芯片EPCB 01设计在一个商业150 nm CMOS技术的结果。该技术提供了一个薄(50 $μ$ m)的高电阻率n型硅衬底,以及一个额外的深p阱,允许在像素内集成完整的CMOS电路。已经实现了具有若干变型的收集电极的不同矩阵类型。将介绍DMAPS像素的第一个实现的模拟性能的测量。

英文摘要:

Monolithic Active Pixel Sensors (MAPS) have been developed since the late 1990s based on silicon substrates with a thin epitaxial layer (thickness of 10-15 $μ$m) in which charge is collected on an electrode, albeit by disordered and slow diffusion rather than by drift in a directed electric field. As a consequence, the signal is small ($\approx$ 1000 e$^-$) and the radiation tolerance is much below the LHC requirements by factors of 100 to 1000. In this paper we present the development of a fully Depleted Monolithic Active Pixel Sensors (DMAPS) based on a high resistivity substrate allowing the creation of a fully depleted detection volume. This concept overcomes the inherent limitations of charge collection by diffusion in the standard MAPS designs. We present results from a test chip EPCB01 designed in a commercial 150 nm CMOS technology. The technology provides a thin (50 $μ$m) high resistivity n-type silicon substrate as well as an additional deep p-well which allows to integrate full CMOS circuitry inside the pixel. Different matrix types with several variants of collection electrodes have been implemented. Measurements of the analog performance of this first implementation of DMAPS pixels will be presented.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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