石墨烯场效应晶体管与溶液处理的多层混合有机-无机自组装纳米电介质(SAND)集成。与传统SiO2栅压控制器件相比,所得到的器件具有低工作电压(2 V)、可忽略的滞后、在真空(压力< 2 x 10-5 Torr)中具有> 1.0的本征增益的电流饱和以及整体性能的改善。场效应迁移率和残余载流子浓度的统计分析表明,在整个3英寸晶片上的电介质界面性质和石墨烯晶体管特性的高度空间均匀性。因此,这项工作确立了SAND作为大面积,高性能石墨烯电子产品的有效平台。
英文摘要:
Graphene field-effect transistors are integrated with solution-processed multilayer hybrid organic-inorganic self-assembled nanodielectrics (SANDs). The resulting devices exhibit low-operating voltage (2 V), negligible hysteresis, current saturation with intrinsic gain > 1.0 in vacuum (pressure < 2 x 10-5 Torr), and overall improved performance compared to control devices on conventional SiO2 gate dielectrics. Statistical analysis of the field-effect mobility and residual carrier concentration demonstrate high spatial uniformity of the dielectric interfacial properties and graphene transistor characteristics over full 3 inch wafers. This work thus establishes SANDs as an effective platform for large-area, high-performance graphene electronics.
Wafer-scale Demonstration of High-voltage beta-Ga2O3 MOSFETs with Excellent Uniformity and over 3kV Breakdown Voltages
Yongjiang Laboratory(甬江实验室);Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences(中国科学院宁波材料技术与工程研究所);School of Microelectronics, Fudan University(复旦大学微电子学院);Hangzhou Garen Semiconductor Co., Ltd.(杭州嘉然半导体有限公司)
Flash annealing-engineered wafer-scale relaxor antiferroelectrics for enhanced energy storage performance
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences(中国科学院金属研究所沈阳材料科学国家研究中心);School of Materials Science and Engineering, University of Science and Technology of China(中国科学技术大学材料科学与工程学院);Electron Microscopy Center, School of Chemistry & Chemistry Engineering, Shandong University(山东大学化学与化工学院电子显微镜中心);Electronic Materials Research Laboratory, School of Electronic Science and Engineering, Xi’an Jiaotong University(西安交通大学电子科学与技术学院电子材料研究教育部重点实验室)
An Unsupervised Machine Learning-based Framework for Wafer Scale Variability Analysis and Performance Prediction of Ferroelectric Hf0.5Zr0.5O2 Thin Film Capacitors
Ferroelectrics subject to suitable electric boundary conditions present a steady negative capacitance response. When the ferroelectric is in a heterostructure, this behavior yields a voltage amplification in the other elements, which experience a potential difference larger than the one applied, holding promise for low-power electronics. So far research has focused on verifying this effect and little is known about how to optimize it. Here we describe an electrostatic theory of ferroelectric/dielectric superlattices, convenient model systems, and show the relationship between the negative perm…
Diffusion of hydrogen atoms in silicon layers deposited from molecular beams on dielectric substrates
本文详细研究了分子束低温真空条件下在多层Si $_3$ N $_4$ /SiO $_2$ /c-Si衬底上生长非氢化非晶硅和多晶硅薄膜的过程。氢原子从电介质层扩散到生长膜中被示出为伴随着硅膜在通过CVD沉积的Si $_3$ N $_4$层上或在通过硅晶片的热氧化获得的SiO $_2$层上的生长。利用傅里叶变换红外光谱研究了氢从介质衬底向硅膜迁移的过程。红外光谱中与N-$-$ H键振动相关的谱带处红外吸收的减少和与Si-$-$ N键振动相关的谱带处红外吸收的增加表明,在从分子束沉积Si期间,氢原子离开Si $_3$ N $_4$层。在沉积在Si $_3$ N $_4$和SiO $_2$层上的样品的IR光谱中出现的、归属于Si $-$ H键在$\sim 2100$ cm $^{-1}$处的价振动的吸收带表明氢原子在硅膜中的积累。介电层和硅膜中的氢原子的化学势差解释了氢原子从Si $_3$ N $_4$或SiO $_2$层转移到生长的硅膜中。
In this work, we demonstrate the performance of a silicon-compatible high-performance self-powered photodetector.A wide detection range from visible (405 nm) to near-infrared (1550 nm) light was enabled by the vertical p-n heterojunction between the p-type antimony telluride (Sb2Te3) thin film and the n-type silicon (Si) substrates. A Sb2Te3 film with a good crystal quality, low density of extended defects, proper stoichiometry, p-type nature, and excellent uniformity across a 4-inch wafer was achieved by atomic layer deposition at 80 °C using (Et3Si)2Te and SbCl3 as precursors. The processed …
Gate controllable electronic trap detection method has been demonstrated by regulating the gate potential of MIS devices. This method is based on shift of capacitance voltage (CV) curve as well as flatband voltage (VFB) measure in less than 10 micro-seconds due to injection or ejection of electrons through the metal gate. Using this method, an electronic trap energy distribution was measured in the HfO2 dielectric film and it confirms a maximum number of traps (Delta_NT) of 1.7x1012 cm-2 corresponding to an energy level (Delta_EIL) of 0.45 eV above silicon conduction band (Si-ECB). In comparis…
Over 3 kV and Ultra-Low leakage Vertical (011) \b{eta}-Ga2O3 Power Diodes with Engineered Schottky Contact and High-permittivity Dielectric Field Plate
Absence of an efficient technology of GaAs passivation limits the use of III-V semiconductors in modern electronics. The effect reported here can possibly lead to a solution of this long standing problem. We found that an electrically conducting interfacial channel is formed when insulating metal oxide dielectrics are deposited on untreated semi-insulating GaAs wafers by reactive RF sputtering in argon/oxygen plasma. The conducting channel is n-type with the surface charge density of 10^7 to 10^10 cm^-2 and Hall mobility as high as 6000 cm^2/Vsec, depending on the RF plasma excitation power an…