We use first-principles methods to investigate the adsorption of Cu, Pb, Ag, and Mg onto a H-terminated Si surface. We show that Cu and Pb can adsorb strongly while Ag and Mg are fairly inert. In addition, two types of adsorption states are seen to exist for Pb. We also study the clustering energetics of Cu and Pb on the surface and find that while Cu clusters eagerly, Pb may prefer to form only small clusters of a few atoms. This kind of behavior of impurities is incorporated in kinetic Monte Carlo simulations of wet etching of Si. The simulation results agree with experiments supporting the idea that micromasking by Cu clusters and Pb atoms is the mechanism through which these impurities affect the etching process.
This paper reports a few-layer black phosphorus thickness pattern fabricated by a top-down nanofabrication approach. This was achieved by a new wet etching process that can etch selected regions of few-layer black phosphorus with an atomic layer accuracy. This method is deep-UV and e-beam lithography process compatible,and is free of oxygen and other common doping sources. It provides a feasible patterning approach for largescale manufacturing of few-layer BP materials and devices.
We report that a deionized water etching and thermal annealing technique can be effective for preparing atomically-flat and singly-terminated surfaces of single crystalline SrTiO3 substrates. After a two-step thermal-annealing and deionized-water etching procedure, topography measured by atomic force microscopy shows the evolution of substrates from a rough to step-terraced surface structure. Lateral force microscopy confirms that the atomically-flat surfaces are singly-terminated. Moreover, this technique can be used to remove excessive strontium oxide or hydroxide composites segregated on th…
We study strain relaxation and surface damage of GaN nanopillar arrays fabricated using inductively coupled plasma (ICP) etching and post etch wet chemical treatment. We controlled the shape and surface damage of such nanopillar structures through selection of etching parameters. We compared different substrate temperatures and different chlorine-based etch chemistries to fabricate high quality GaN nanopillars. Room temperature photoluminescence and Raman scattering measurements were carried to study the presence of surface defect and strain relaxation on these nanostructures, respectively. We…
Low-defect-density Ge thin films are critical in Ge based optical devices (optical detectors, LEDs and Lasers) integrated with Si electronic devices for low-cost, highly integrated photonic circuits. In this work, Ge thin films prepared by wet etching with four different solutions were studied in terms of the surface morphology, defect density and achievable thickness. Both nanostrip-based solution (1:1:10) and HCl-based solution (1:1:5) were able to wet-etch 535 micron thick bulk-Ge substrates to Ge films thinner than 10 micron within 53 hours. The corresponding RMS surface roughness was 32 n…
Molten metallic nanoparticles have recently been used to construct graphene nanostructures with crystallographic edges. The mechanism by which this happens, however, remains unclear. Here, we present a simple model that explains how a droplet can etch graphene. Two factors possibly contribute to this process: a difference between the equilibrium wettability of graphene and the substrate that supports it, or the large surface energy associated with the graphene edge. We calculate the etching velocities due to either of these factors and make testable predictions for evaluating the significance …
We investigate the effect of strain on the etching rate of two SiGe wet etchants, namely NH4OH:H2O2 and H2O2. For both etchants, we found that there is no appreciable strain selectivity, i.e. the etching rates do not depend on the actual strain state in the SiGe films. Instead, for the NH4OH:H2O2 solution, the rates are primarily determined by the Ge content. Finally, we show that both etchants are isotropic with no preferential etching of particular facets.
Wet etching is an essential and complex step in semiconductor device processing. Metal-Assisted Chemical Etching (MacEtch) is fundamentally a wet but anisotropic etching method. In the MacEtch technique, there are still a number of unresolved challenges preventing the optimal fabrication of high-aspect-ratio semiconductor micro- and nanostructures, such as undesired etching, uncontrolled catalyst movement, non-uniformity and micro-porosity in the metal-free areas. Here, an optimized MacEtch process using with a nanostructured Au catalyst is proposed for fabrication of Si high aspect ratio micr…
A chemical etching method was developed for (110) and (001) NdGaO3 single crystal substrates in order to obtain an atomically flat GaO2-x - terminated surface. Depending on the surface step density the substrates were etched in pH-controlled NH4F- or NH4Cl-based solutions, followed by an annealing step at temperatures of 800-1000oC, in air or in oxygen flow, in order to recrystallize the surface. Atomic Force Microscopy (AFM) and high-pressure Reflection High Energy Electron Diffraction (RHEED) were used to analyse the surface morphology of the samples after every treatment. Studies on the che…
Vertical structures of SiO$_{2}$ sandwiched between a top tungsten electrode and conducting non-metal substrate were fabricated by dry and wet etching methods. Both structures exhibit similar voltage-controlled memory behaviors, in which short voltage pulses (1 $μ$s) can switch the devices between high- and low-impedance states. Through the comparison of current-voltage characteristics in structures made by different methods, filamentary conduction at the etched oxide edges is most consistent with the results, providing insights into similar behaviors in metal/SiO/metal systems. High ON/OFF ra…
Si(100) surfaces were prepared by wet-chemical etching followed by 0.3-1.5keV Ar ion sputtering, either at elevated or room temperature. After a brief anneal under ultrahigh vacuum conditions, the resulting surfaces were examined by scanning tunneling microscopy. We find that wet-chemical etching alone cannot produce a clean and flat Si(100) surface. However, subsequent 300eV Ar ion sputtering at room temperature followed by a 973K anneal yields atomically clean and flat Si(100) surfaces suitable for nanoscale device fabrication.
Spontaneous formation of geometric patterns is a fascinating, ubiquitous process that provides fundamental insights into the roles of symmetry breaking, anisotropy and nonlinear interactions in emergent phenomena. Here we report dynamic, highly ordered topographic patterns on the surface of diamond that span multiple length scales and have a symmetry controlled by the chemical species of a precursor gas used in electron beam induced etching (EBIE). This behavior reveals an underlying etch rate anisotropy and an electron energy transfer pathway that has been overlooked by existing EBIE theory. …
Surface terminations for 2D MXene have dramatic impacts on physicochemical properties. The commonly etching methods usually introduce -F surface termination or metallic into MXene. Here, we present a new molten salt assisted electrochemical etching (MS-E-etching) method to synthesize fluorine-free Ti3C2Tx without metallics. Due to performing electrons as reaction agent, the cathode reduction and anode etching can be spatially isolated, thus no metallic presents in Ti3C2Tx product. Moreover, the Tx surface terminations can be directly modified from -Cl to -O and/or -S in one pot process. The ob…
Ultrathin GaN nanowires (NWs) are attractive to maximize surface effects and as building block in high-frequency transistors. Here, we introduce a facile route for the top-down fabrication of ordered arrays of GaN NWs with aspect ratios exceeding $10$ and diameters below $20\,$nm. Highly uniform thin GaN NWs are first obtained by using electron beam lithography to pattern a Ni/SiN$_x$ hard mask, followed by dry etching and wet etching in hot KOH. The SiN$_x$ is found to work as an etch stop during wet etching in hot KOH. Arrays with NW diameters down to $(33 \pm5)\,$nm can be achieved with a y…
We demonstrate a novel method for nanowire formation by natural selection during wet chemical etching in boiling Phosphoric acid. It is observed that wire lateral dimensions of sub-10 nm and lengths of 700 nm or more have been naturally formed during the wet etching. The dimension variation is controlled through etching times wherein the underlying cause is the merging of the nearby crystallographic hexagonal etch pits. The emission processes involving excitons are found to be efficient and lead to enhanced emission characteristics. The exciton binding energy is augmented by using quantum conf…
MXenes, a family of layered transition metal carbides and nitrides, have shown great promise for use in emerging electrochemical energy storage devices, including batteries and supercapacitors. MXene surfaces are terminated by mixed -O, -F and -OH functional groups as a result of the chemical etching production process. These functional groups are known to be randomly distributed over the surfaces, with limited experimental control over their composition. There is considerable debate regarding the contribution of these functional groups to the properties of the underlying MXene material. For i…
All-dry processing of 3C-SiC nanomechanical string resonators for extreme aspect ratios and high intrinsic quality factor
Technical University of Munich（慕尼黑工业大学）；Munich Center for Quantum Science and Technology (MCQST)（慕尼黑量子科学与技术中心）；TUM Center for Quantum Engineering (ZQE)（慕尼黑工业大学量子工程中心）
Near-surface nitrogen-vacancy ({NV}) centers in diamond have been successfully employed as atomic-sized magnetic field sensors for external spins over the last years. A key challenge is still to develop a method to bring NV centers at nanometer proximity to the diamond surface while preserving their optical and spin properties. To that aim we present a method of controlled diamond etching with nanometric precision using an oxygen inductively coupled plasma (ICP) process. Importantly, no traces of plasma-induced damages to the etched surface could be detected by X-ray photoelectron spectroscopy…
Etching of elemental layers in oxide molecular beam epitaxy by O2-assisted formation and evaporation of their volatile suboxide: The examples of Ga and Ge
The interaction of Mn with Ge quantum dots (QD), which are bounded by {105} facets, and the strained Ge wetting layer (WL), terminated by a (001) surface, is investigated with scanning tunneling microscopy (STM). Mn is deposited on the Ge QD and WL surface in sub-monolayer concentrations, and subsequently annealed up to temperature of 400 C. Bonding and surface topography were measured with STM during the annealing process. Mn forms flat islands on the Ge {105} facet, whose shape and position is guided by the rebonded step reconstruction. The images show a hybridization of Mn-d band and empty …
In the frame of the development of thin crystalline silicon solar cell technologies, surface nanopatterning of silicon is gaining importance. Its impact on the material quality is, however, not yet fully controlled.We investigate here the influence of surface nanotexturing on the series resistance of a contacting scheme relevant for thin-film crystalline silicon heterojunction solar cells. Two dimensional periodic nanotextures are fabricated using a combination of nanoimprint lithography and either dry or wet etching, while random pyramid texturing is used for benchmarking. We compare these te…
Silicon nanowires are prepared by the method of the two-step metal-assisted wet chemical etching. We have analyzed the structure of solid, rough and porous nanowire surfaces of boron-doped silicon substrates with resistivities of ρ> 1000 Ωcm, ρ= 14-23 Ωcm, ρ< 0.01 Ωcm by scanning electron microscopy and nitrogen gas adsorption. Silicon nanowires prepared from highly-doped silicon reveal mesopores on their surface. However, we found a limit for pore formation. Pores were only formed by etching below a critical H$_2$O$_2$ concentration (c$_{\mbox{H}_2\mbox{O}_2}$ < 0.3 M). Furthermore, we have d…
