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arXiv 1202.2256cond-mat.mtrl-sci
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选择性化学刻蚀控制NdGaO3晶体表面的终止

Termination control of NdGaO3 crystal surfaces by selective chemical etching

V. Leca, D. H. A. Blank, G. Rijnders

摘要:

为了获得原子级平坦的GaO 2-x终端表面,发展了一种化学腐蚀方法,用于(110)和(001)NdGaO 3单晶衬底。根据表面台阶密度,在pH控制的NH 4F或NH 4Cl基溶液中蚀刻衬底,然后在空气或氧气流中在800- 1000 ℃的温度下进行退火步骤,以使表面再结晶。利用原子力显微镜(AFM)和高压反射高能电子衍射(RHEED)分析了每次处理后样品的表面形貌。对终止层的化学性质和特性的研究表明,化学蚀刻的NdGaO 3衬底表面具有GaO 2-x终止,并且(110)和(001)NdGaO 3表面的特征在于不同的自由表面能,后者的自由表面能较低。

英文摘要:

A chemical etching method was developed for (110) and (001) NdGaO3 single crystal substrates in order to obtain an atomically flat GaO2-x - terminated surface. Depending on the surface step density the substrates were etched in pH-controlled NH4F- or NH4Cl-based solutions, followed by an annealing step at temperatures of 800-1000oC, in air or in oxygen flow, in order to recrystallize the surface. Atomic Force Microscopy (AFM) and high-pressure Reflection High Energy Electron Diffraction (RHEED) were used to analyse the surface morphology of the samples after every treatment. Studies on the chemistry and characteristics of the terminating layer showed that the chemically etched NdGaO3 substrate surface has a GaO2-x termination and that the (110) and (001) NdGaO3 surfaces are characterized by a different free surface energy, which is lower for latter.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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