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arXiv 2406.02442physics.app-phcond-mat.mtrl-sci
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用于共形电子器件的超薄晶体管与电路

Ultra-thin transistors and circuits for conformable electronics

Federico Parenti, Riccardo Sargeni, Elisabetta Dimaggio, Francesco Pieri, Filippo Fabbri, Tommaso Losi, Fabrizio Antonio Viola, Arindam Bala, Zhenyu Wang, Andra… 展开作者

Federico Parenti, Riccardo Sargeni, Elisabetta Dimaggio, Francesco Pieri, Filippo Fabbri, Tommaso Losi, Fabrizio Antonio Viola, Arindam Bala, Zhenyu Wang, Andras Kis, Mario Caironi, Gianluca Fiori

AI总结:

提出一种自下而上、基于溶液的混合集成方法,用 MoS2、PVF 和喷墨打印 PEDOT:PSS 在薄聚酰亚胺上制备高性能超薄可共形晶体管及数模电路。

摘要:

使电子器件完美贴合非平面和粗糙表面(例如人体皮肤)是一项极具挑战性的任务;若能解决,将在健康、机器人、可穿戴电子、人机接口和物联网等具有高度经济与科学价值的领域开辟新应用。成功的关键在于确定一种技术,既能制造超薄器件,又能利用最终厚度极薄、具有高机械柔性和优异电学性能的材料。本文报道了一种用于构建高性能、超薄且可共形电子器件和电路的混合方法:该方法基于将最终厚度极薄的半导体过渡金属二硫化物(TMDC,即 MoS2)与有机栅极介电材料(即聚乙烯醇缩甲醛 PVF)相集成,并结合导电 PEDOT:PSS 墨水的喷墨打印来定义电极。通过这种低成本、完全自下而上且基于溶液的方法,在数微米厚的聚酰亚胺衬底上依次堆叠超薄(纳米级)薄膜层,制造出晶体管以及简单的数字和模拟电路;该衬底保证了目标应用所必需的高柔性。

英文摘要:

Adapting electronics to perfectly conform to non-planar and rough surfaces, such as human skin, is a very challenging task which, if solved, could open up new applications in fields of high economic and scientific interest ranging from health to robotics, wearable electronics, human machine interface and Internet of Things. The key to success lies in defining a technology that can lead to the fabrication of ultra-thin devices while exploiting materials that are ultimately thin, with high mechanical flexibility and excellent electrical properties. Here, we report a hybrid approach for the definition of high-performance, ultra-thin and conformable electronic devices and circuits, based on the integration of ultimately thin semiconducting transition metal dichalcogenides (TMDC), i.e., MoS2, with organic gate dielectric material, i.e., polyvinyl formal (PVF) combined with the ink-jet printing of conductive PEDOT:PSS ink for electrodes definition. Through this cost-effective, fully bottom-up and solution-based approach, transistors and simple digital and analogue circuits are fabricated by a sequential stacking of ultrathin (nanometer) layers on a few micron thick polyimide substrate, which guarantees the high flexibility mandatory for the targeted applications.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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