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arXiv 2401.03382physics.optics
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用于光子集成电路的低弯曲损耗、高折射率、复合形态超快激光写入波导

Low Bend Loss, High Index, Composite Morphology Ultra-fast Laser Written Waveguides for Photonic Integrated Circuits

Andrew J. Ross-Adams, Toney T. Fernandez, Michael J. Withford, Simon Gross

AI总结:

本文提出一种在硼铝硅酸盐玻璃中多遍激光写入的复合三维波导,通过协同热与非热改性机制实现高折射率对比度,将1550 nm下弯曲损耗截止半径从10 mm降至4 mm。

摘要:

我们展示了一种新型复合激光写入三维波导,该波导在硼铝硅酸盐玻璃中制备,折射率对比度为1.12×10^-2。该波导采用多遍写入方法制备,该方法同时利用了热刻写区和非热刻写区各自的折射率改性机制。我们介绍了为最大化正折射率变化而对写入参数进行的研究与优化,并最终展示了激光写入波导弯曲损耗性能在现有技术水平上的显著进步。在1550 nm传播波长下,1.0 dB cm^-1弯曲损耗截止半径从10 mm降低至4 mm。

英文摘要:

We demonstrate a novel, composite laser written 3D waveguide, fabricated in boro-aluminosilicate glass, with a refractive index contrast of 1.12 x 10^-2. The waveguide is fabricated using a multi-pass approach which leverages the respective refractive index modification mechanisms of both the thermal and athermal inscription regimes. We present the study and optimisation of inscription parameters for maximising positive refractive index change and ultimately demonstrate a dramatic advancement on the state of the art of bend losses in laser-written waveguides. The 1.0 dB cm^-1 bend loss cut-off radius is reduced from 10 mm to 4 mm, at a propagation wavelength of 1550 nm.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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