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arXiv 1301.2197physics.optics
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新型微米级弯曲实现的新型硅光子集成平台

New silicon photonics integration platform enabled by novel micron-scale bends

Matteo Cherchi, Sami Ylinen, Mikko Harjanne, Markku Kapulainen, Timo Aalto

摘要:

尽管亚微米硅波导已被提出用于光子器件的密集集成,但迄今为止,市场上的光波电路主要依赖于具有微米级芯尺寸的波导。这些更大的波导具有更容易制造、更高的可靠性和更好的光纤接口。在低横向折射率对比度的情况下,获得了具有大纤芯尺寸的单模操作。因此,提高集成度和降低微米级波导电路成本的主要限制是它们的毫米至厘米级最小弯曲半径。幸运的是,具有微米级硅芯的单模脊形波导可以局部转化为具有非常高横向折射率对比度的多模条形波导。在这里,我们展示了如何用这些波导实现欧拉螺旋弯曲,弯曲半径低于10 μm,基模损耗低于0.02 dB/90°,为基于微米级波导的新型密集集成平台铺平了道路。

英文摘要:

Even though submicron silicon waveguides have been proposed for dense integration of photonic devices, to date the lightwave circuits on the market mainly rely on waveguides with micron-scale core dimensions. These larger waveguides feature easier fabrication, higher reliability and better interfacing to optical fibres. Single-mode operation with large core dimensions is obtained with low lateral refractive index contrast. Hence, the main limitation in increasing the level of integration and in reducing the cost of micron-scale waveguide circuits is their mm- to cm-scale minimum bending radius. Fortunately, single-mode rib waveguides with a micron-scale silicon core can be locally transformed into multi-mode strip waveguides that have very high lateral index contrast. Here we show how Euler spiral bends realized with these waveguides can have bending radii below 10 μm and losses below 0.02 dB/90° for the fundamental mode, paving way for a novel densely integrated platform based on micron-scale waveguides.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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