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arXiv 1302.2658physics.optics
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低弯曲损耗波导实现紧凑、高效的3D光子芯片

Low bend loss waveguides enable compact, efficient 3D photonic chips

Alexander Arriola, Simon Gross, Nemanja Jovanovic, Ned Charles, Peter G. Tuthill, Santiago M. Olaizola, Alexander Fuerbach, Michael J. Withford

摘要:

我们提出了一种新的方法来制造低弯曲损耗飞秒激光写入波导,利用激光诱导折射率修改的差分热稳定性。该技术由两步工艺组成;第一步涉及制造大型多模波导,而第二步包括热后退火工艺,该工艺消除了折射率分布的外环,从而实现C波段的单模操作。通过使用这个程序,我们报告波导与尖锐的弯曲(下至16.6毫米半径)和高(80%)的归一化吞吐量。这个过程被用来制造一个高效的3D,光子器件称为光瞳重映射器,第一次具有可忽略的弯曲损耗。该工艺还将允许基于10 - 100个波导的复杂芯片以短的制造时间在紧凑的足迹中实现。

英文摘要:

We present a novel method to fabricate low bend loss femtosecond-laser written waveguides that exploits the differential thermal stabilities of laser induced refractive index modifications. The technique consists of a two-step process; the first involves fabricating large multimode waveguides, while the second step consists of a thermal post-annealing process, which erases the outer ring of the refractive index profile, enabling single mode operation in the C-band. By using this procedure we report waveguides with sharp bends (down to 16.6 mm radius) and high (80%) normalized throughputs. This procedure was used to fabricate an efficient 3D, photonic device known as a pupil-remapper with negligible bend losses for the first time. The process will also allow for complex chips, based on 10's - 100's of waveguides to be realized in a compact foot print with short fabrication times.

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