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arXiv 2301.02577cond-mat.mtrl-sci
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用X射线光电子能谱学研究Ti在$_x$ W $_{1-x}$ /Cu异质结构中的扩散动力学

Capturing the dynamics of Ti diffusion across Ti$_x$W$_{1-x}$/Cu heterostructures using X-ray photoelectron spectroscopy

Curran Kalha, Pardeep K. Thakur, Tien-Lin Lee, Michael Reisinger, Johannes Zechner, Michael Nelhiebel, Anna Regoutz

摘要:

相邻材料之间的相互扩散现象在半导体器件架构中非常普遍,并且可能对工业提出主要的可靠性挑战。为了充分捕捉和更好地理解这些现象,实验方法必须超越静态和事后研究,包括原位和操作中的设置。这里,软X射线和硬X射线光电子能谱学(SXPS和HAXPES)用于实时监测跨代理器件的扩散。该器件由Si/SiO \textsubscript{2} /Ti $_x$ W $_{1-x}$(300 nm)/Cu(25 nm)薄膜材料叠层组成,其中Ti $_x$ W $_{1-x}$膜充当Si和Cu之间的扩散阻挡层。扩散的监测是通过在原位退火到673 K的同时连续收集光谱来实现的。Ti内的TiW被发现是高度流动的退火过程中,扩散出的障碍,并积累在Cu表面。增加Ti $_x$ W $_{1-x}$膜内的Ti浓度增加了累积的Ti的量,并且在低至550 K的温度下首先在Cu表面检测到Ti。令人惊讶的是,在低Ti浓度($x$ = 0.054)下,W也是可移动的并且与Ti一起扩散。这些结果为扩散屏障组合物在器械应用期间对其功效的重要性提供了关键证据,从而深入了解了其有效性和局限性的机制。

英文摘要:

Interdiffusion phenomena between adjacent materials are highly prevalent in semiconductor device architectures and can present a major reliability challenge for the industry. To fully capture and better understand these phenomena, experimental approaches must go beyond static and post-mortem studies to include in-situ and in-operando setups. Here, soft and hard X-ray photoelectron spectroscopy (SXPS and HAXPES) is used to monitor diffusion in real-time across a proxy device. The device consists of a Si/SiO\textsubscript{2}/Ti$_x$W$_{1-x}$(300 nm)/Cu(25 nm) thin film material stack, with the Ti$_x$W$_{1-x}$ film acting as a diffusion barrier between Si and Cu. The monitoring of diffusion is achieved through the continuous collection of spectra whilst in-situ annealing to 673 K. Ti within the TiW is found to be highly mobile during annealing, diffusing out of the barrier and accumulating at the Cu surface. Increasing the Ti concentration within the Ti$_x$W$_{1-x}$ film increases the quantity of accumulated Ti, and Ti is first detected at the Cu surface at temperatures as low as 550 K. Surprisingly, at low Ti concentrations ($x$ = 0.054), W is also mobile and diffuses alongside Ti. These results provide crucial evidence for the importance of diffusion barrier composition on their efficacy during device application, delivering insights into the mechanisms underlying their effectiveness and limitations.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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