arXiv 2212.047932022-12-09physics.ins-det

用于CMS第2阶段升级的HPK $n^+$ - $p$平面像素传感器的评价

Evaluation of HPK $n^+$-$p$ planar pixel sensors for the CMS Phase-2 upgrade

The Tracker Group of the CMS Collaboration

摘要：

为了应对大型强子对撞机（HL-LHC）计划于2029年开始运行的高亮度升级的挑战性环境，CMS将更换其整个跟踪系统。对跟踪器的要求主要取决于10年的长运行时间，在最终性能方案中瞬时峰值亮度高达$7.5\times 10^{34}$ cm $^{-2}$ s $^{-1}$。取决于与相互作用点的径向距离，硅传感器将接收对应于高达$Φ_{\text{eq}} = 3.5\times 10^{16}$ cm $^{-2}$的非电离能量损失的粒子注量。本论文主要研究平面像素传感器的设计和性能，其通量可达$Φ_{\text{eq}} = 1.4\times 10^{16}$ cm $^{-2}$。为了开发适当的平面像素传感器，启动了R &D程序，其包括在150 mm（6“）晶片上的$n^+$-$p$传感器，该晶片具有150 $μm$的有效厚度，像素尺寸为$100\times 25$ $μm^2$和$50\times 50$ $μm^2$，由Hamamatsu制造。用ROC 4Sens和RD 53 A读出芯片制作了单芯片模块。用质子和中子进行辐照，以及在DESY进行了广泛的试验束活动。本文介绍了以ROC 4Sens读出芯片为主的各种组件的研究。它表明，多种设计满足击穿电压，漏电流和效率方面的要求。$50\times 50$ $μm^2$像素的单点分辨率测量为4.0 $μm$（对于未辐照的样品）和6.3 $μm$（在辐照至$Φ_{\text{eq}} = 7.2\times 10^{15}$ cm $^{-2}$后）。

英文摘要：

To cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), scheduled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are largely determined by the long operation time of 10 years with an instantaneous peak luminosity of up to $7.5\times 10^{34}$ cm$^{-2}$s$^{-1}$ in the ultimate performance scenario. Depending on the radial distance from the interaction point, the silicon sensors will receive a particle fluence corresponding to a non-ionizing energy loss of up to $Φ_{\text{eq}} = 3.5\times 10^{16}$ cm$^{-2}$ . This paper focuses on planar pixel sensor design and qualification up to a fluence of $Φ_{\text{eq}} = 1.4\times 10^{16}$ cm$^{-2}$. For the development of appropriate planar pixel sensors an R\&D program was initiated, which includes $n^+$-$p$ sensors on 150 mm (6'') wafers with an active thickness of 150 $μm$ with pixel sizes of $100\times 25$ $μm^2$ and $50\times 50$ $μm^2$ manufactured by Hamamatsu. Single chip modules with ROC4Sens and RD53A readout chips were made. Irradiation with protons and neutrons, as well was an extensive test beam campaign at DESY were carried out. This paper presents the investigation of various assemblies mainly with ROC4Sens readout chips. It demonstrates that multiple designs fulfill the requirements in terms of breakdown voltage, leakage current and efficiency. The single point resolution for $50\times 50$ $μm^2$ pixels is measured as 4.0 $μm$ for non-irradiated samples, and 6.3 $μm$ after irradiation to $Φ_{\text{eq}} = 7.2\times 10^{15}$ cm$^{-2}$.

机构、总结、中文摘要均由AI分析而来，可能存在错误，请以论文正文为准。

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英文摘要：

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