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arXiv 1802.08016physics.opticsphysics.app-ph
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光子集成电路元件级测试中laser写入现象的微观表征

Microscopic characterisation of laser-written phenomena for component-wise testing of photonic integrated circuits

Jun Guan, Xiang Liu, Adrian J. Menssen, Martin J. Booth

摘要:

利用飞秒激光直接写入的光子集成电路在量子信息处理等领域显示出巨大的应用潜力。许多应用,如基于光子的量子计算,要求PIC的升级和更高的光学性能,如可控的偏振依赖性和更低的损耗。为了克服当前在制造精度、可重复性和材料均匀性方面的限制,期望以组件方式对大规模PIC进行无损测试的解决方案来满足这些日益严格的要求。在这里,我们展示了一种解决方案,通过预测PIC组件的性能,基于自适应光学三次谐波产生(THG)三维(3D)显微镜成像的非破坏性组件的测试。可以在多组件PIC内的任何组件或其部分上执行3D THG成像。此外,通过发现新现象,我们还证明了3D THG显微镜为研究透明材料中光-物质相互作用的基本原理提供了一条新途径。

英文摘要:

Photonic integrated circuits (PICs) directly written with a femtosecond laser have shown great potential in many areas such as quantum information processing (QIP). Many applications, like photon-based quantum computing, demand the up-scaling of PICs and ever-higher optical performance, such as controllable polarisation dependence and lower loss. In order to overcome current limitations in fabrication precision, repeatability and material uniformity, a solution for non-destructive testing of large-scale PICs in a component-wise manner is desired to meet those ever-stricter demands. Here we demonstrate a solution for non-destructive component-wise testing by predicting the performance of a PIC component based on imaging with an adaptive optical third-harmonic-generation (THG) three-dimensional (3D) microscope. The 3D THG imaging can be performed on any component or part of it inside multi-component PIC. Moreover, through discovering new phenomena we also demonstrated that 3D THG microscopy provides a new pathway towards studying the fundamentals of light-matter interaction in transparent materials.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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