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arXiv 1708.03809cond-mat.mtrl-sciphysics.app-ph
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AlN-Si预生长界面的早期原位应力特征对氮化物与(111)Si成功结合的影响

An Early In-Situ Stress Signature of the AlN-Si Pre-growth Interface for Successful Integration of Nitrides with (111) Si

Hareesh Chandrasekar, Nagaboopathy Mohan, Abheek Bardhan, KN Bhat, Navakanta Bhat, N Ravishankar, Srinivasan Raghavan

摘要:

在Si(111)衬底上MOCVD生长的III-A族氮化物器件叠层的集成关键取决于生长的第一AlN缓冲层的质量。无氧化物且光滑的Si表面是使这样的层成核的主要要求。一个单一的参数,AlN层生长应力,被证明是一个早期的(50 nm内),明确(<0.5 GPa versus >1 GPa)和故障安全的预生长表面的指标,和成功的外延所需的AlN质量。应力产生的晶粒合并模型被用来关联生长应力、AlN-Si界面和晶体质量。

英文摘要:

The integration of MOCVD grown group III-A nitride device stacks on Si (111) substrates is critically dependent on the quality of the first AlN buffer layer grown. A Si surface that is both oxide-free and smooth is a primary requirement for nucleating such layers. A single parameter, the AlN layer growth stress, is shown to be an early (within 50 nm), clear (<0.5 GPa versus >1 GPa) and fail-safe indicator of the pre-growth surface, and the AlN quality required for successful epitaxy. Grain coalescence model for stress generation is used to correlate growth stress, the AlN-Si interface and crystal quality.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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