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arXiv 1607.05191cond-mat.mtrl-sciphysics.chem-ph
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室温下在多晶硅衬底上制备Pt $_3$ Si/Pt $_2$ Si薄膜

Room-temperature formation of Pt$_3$Si/Pt$_2$Si films on poly-Si substrates

V. P. Dubkov, S. A. Mironov, K. V. Chizh, V. A. Yuryev

摘要:

提出了一种在室温下用Pt磁控溅射和湿法腐蚀在多晶硅衬底上制备Pt $_3$ Si/Pt $_2$ Si双层薄膜的方法,获得了这种薄膜,研究了它的结构和相组成,并估算了它的层厚。我们通过直接的X射线光电子能谱测量验证了我们以前观察到的Pt $_2$ Si层formaton之间的Pt和多晶Si膜作为结果的Pt磁控溅射在室温下。该层可能是由于磁控管等离子体中的Pt离子的温度足够高,足以在Si表面上形成硅化物膜的化学反应而出现的。Pt $_3$ Si层可能由Pt-Pt $_3$ Si层(Pt $_{95}$ Si $_5$)形成,该层在磁控溅射期间由于通过湿蚀刻除去Pt而在Pt膜下产生。

英文摘要:

We propose a way of formation of thin bilayer Pt$_3$Si/Pt$_2$Si films at room temperature on poly-Si substrates by Pt magnetron sputtering and wet etching, obtain such film, investigate its structure and phase composition and estimate the thickness of its layers. We verify by direct x-ray photoelectron-spectroscopic measurements our previous observation of the Pt$_2$Si layer formaton between Pt and poly-Si films as a result of Pt magnetron sputtering at room temperature. This layer likely appears due to high enough temperature of Pt ions in the magnetron plasma sufficient for chemical reaction of the silicide film formation on the Si surface. The Pt$_3$Si layer likely forms from the Pt--Pt$_3$Si layer (Pt$_{95}$Si$_5$), which arises under Pt film during the magnetron sputtering, as a result of Pt removal by wet etching.

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