arXivDaily arXiv每日学术速递 周一至周五更新
arXiv 1406.7475cond-mat.mes-hall
收藏

铝栅硅单电子器件的电荷偏移稳定性

Charge Offset Stability in Si Single Electron Devices with Al Gates

Neil M. Zimmerman, Chih-Hwan Yang, Nai Shyan Lai, Wee Han Lim, Andrew S. Dzurak

摘要:

我们报告的电荷偏移漂移(时间稳定性)在硅单电子器件(SED)定义与铝(Al)栅极。电荷偏移漂移的大小(0.15 $e$)介于Al/AlO $_x$ /Al隧道结的大小(大于1 $e$)和用Si栅极限定的Si SED的大小(0.01 $e$)之间。该值范围表明,AlO $_x$中的缺陷是电荷偏移漂移不稳定性的主要原因。

英文摘要:

We report on the charge offset drift (time stability) in Si single electron devices (SEDs) defined with aluminum (Al) gates. The size of the charge offset drift (0.15 $e$) is intermediate between that of Al/AlO$_x$/Al tunnel junctions (greater than 1 $e$) and Si SEDs defined with Si gates (0.01 $e$). This range of values suggests that defects in the AlO$_x$ are the main cause of the charge offset drift instability.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

↑