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arXiv 1206.2872cond-mat.mes-hall
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全CMOS Si单电子器件的制备及电学特性

Fabrication and Electrical Characterization of Fully CMOS Si Single Electron Devices

P. J. Koppinen, M. D. Stewart,, Neil M. Zimmerman

摘要:

我们提出了与CMOS技术和协议制造的硅单电子器件的电气数据。容易调整的设备显示干净的库仑钻石在T = 30 mK和0.01 e的电荷偏移漂移超过八天。此外,该器件表现出稳健的晶体管特性,包括阈值电压在约0.5 V内的均匀性、大于10 GΩ的栅极电阻以及在高达4 MV/cm的电场中对介质击穿的抗扰性。这些结果突出了用于单电子器件制造的完全CMOS工艺在器件性能方面的益处。

英文摘要:

We present electrical data of silicon single electron devices fabricated with CMOS techniques and protocols. The easily tuned devices show clean Coulomb diamonds at T = 30 mK and charge offset drift of 0.01 e over eight days. In addition, the devices exhibit robust transistor characteristics including uniformity within about 0.5 V in the threshold voltage, gate resistances greater than 10 GΩ, and immunity to dielectric breakdown in electric fields as high as 4 MV/cm. These results highlight the benefits in device performance of a fully CMOS process for single electron device fabrication.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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