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arXiv 1005.4295cond-mat.stat-mechcond-mat.dis-nn
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硬球无规堆积中的热输运

Heat Transport in a Random Packing of Hard Spheres

Shigenori Matsumoto, Tomoaki Nogawa, Takashi Shimada, Nobuyasu Ito

摘要:

用非平衡分子动力学模拟研究了硬球无规堆积中的热传导。我们发现,硬球随机包装显示出更高的热导率比结晶包装具有相同的包装分数。在相同的压力下,随机结构导致热导率仅比晶体填充降低10%,这与非晶材料可以具有与晶体相当的高热导率的实验事实一致。

英文摘要:

Heat conduction in a random packing of hard spheres is studied by nonequilibrium molecular dynamics simulation. We find a hard-sphere random packing shows higher thermal conductivity than a crystalline packing with same packing fraction. Under the same pressure, the random structure causes reduction of thermal conductivity by only 10% from crystalline packing, which is consistent with the experimental fact that amorphous materials can have high thermal conductivity which is comparable to that of crystals.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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