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arXiv 0801.0771cond-mat.mtrl-sci
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晶格热膨胀与温度关系的局域带平均方法

An approach to local band average for the temperature dependence of lattice thermal expansion

Chang Q. Sun

摘要:

长期以来,尽管从经典或量子近似的各种角度进行了建模考虑,但低温下晶格热膨胀非线性背后的机制一直令人困惑。本文给出了一个用局部键平均表示的解析解,表明在不考虑模Gruneisen常数或体弹性模量的情况下,热膨胀系数与德拜近似的比热密切相关。将德拜温度和原子结合能作为输入与实验观测相匹配的预测结果表明,目前的方法可以代表温度诱导晶格膨胀的真实情况,尽管声子态密度的确切形式需要进一步改进。

英文摘要:

It has long been puzzling regarding the mechanism behind the nonlinearity of lattice thermal expansion at low temperatures despite modeling considerations from various perspectives in classical or quantum approximations. An analytical solution in terms of local bond average is presented herewith showing that the thermal expansion coefficient follows closely the specific heat of Debye approximation without the involvement of mode Gruneisen constant or the bulk modulus. Matching predictions to experimental observations using the Debye temperature and the atomic cohesive energy as input evidences that the current approach may represent the true situation of temperature induced lattice expansion though the exact form of phonon density of states need to be considered for further refinement.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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