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arXiv 0709.1868cond-mat.mtrl-sci
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大功率AlGaN/GaN HEMT的温度分析

A Temperature Analysis of High-power AlGaN/GaN HEMTs

J. Das, H. Oprins, H. Ji, A. Sarua, W. Ruythooren, J. Derluyn, M. Kuball, M. Germain, G. Borghs

摘要:

氮化镓已成为太空、国防和民用应用的战略性优越材料,主要用于RF和毫米波频率的功率放大。对于AlGaN/GAN高电子迁移率晶体管(HEMT),使用系统级封装(SIP)方法可以获得与低成本和高灵活性相结合的出色性能。由于热管理对于这些高功率应用是极其重要的,因此提出了将HEMT混合集成到AlN载体衬底上。在这项研究中,我们调查的AlGaN/GAN HEMT集成到AlN使用倒装芯片安装的温度性能。因此,我们使用热模拟结合使用显微拉曼光谱和直流电分析的实验结果。

英文摘要:

Galliumnitride has become a strategic superior material for space, defense and civil applications, primarily for power amplification at RF and mm-wave frequencies. For AlGaN/GaN high electron mobility transistors (HEMT), an outstanding performance combined together with low cost and high flexibility can be obtained using a System-in-a-Package (SIP) approach. Since thermal management is extremely important for these high power applications, a hybrid integration of the HEMT onto an AlN carrier substrate is proposed. In this study we investigate the temperature performance for AlGaN/GaN HEMTs integrated onto AlN using flip-chip mounting. Therefore, we use thermal simulations in combination with experimental results using micro-Raman spectroscopy and electrical dc-analysis.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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