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arXiv 2311.03350math.OCstat.ML
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面向混合整数线性优化的可微割平面层

Differentiable Cutting-plane Layers for Mixed-integer Linear Optimization

Gabriele Dragotto, Stefan Clarke, Jaime Fernández Fisac, Bartolomeo Stellato

AI总结:

针对参数化混合整数线性优化问题,提出可微割平面层概念及组合多割平面层的可微割平面算法,经离线训练后可快速生成低整数间隙解,且能泛化到新实例并捕捉参数结构。

摘要:

我们研究求解一类参数化混合整数线性优化问题的问题,这类问题的输入数据中部分条目会发生变化。我们提出割平面层(CPL)的概念,即一种可微割平面生成器,可将问题数据和之前的迭代结果映射为割平面。我们提出了一种用于生成分割割(split cuts)的CPL实现,并通过组合多个CPL,设计了一种可微割平面算法,该算法利用了参数化实例的重复特性。在离线阶段,我们通过更新控制CPL的内部参数来训练算法,从而改变割平面的生成。训练完成后,我们的算法能以可预测的执行时间和固定数量的割平面,计算出具有低整数间隙的解。初步计算测试表明,我们的算法能在未见过的实例上泛化,并能捕捉潜在的参数化结构。

英文摘要:

We consider the problem of solving a family of parametric mixed-integer linear optimization problems where some entries in the input data change. We introduce the concept of cutting-plane layer (CPL), i.e., a differentiable cutting-plane generator mapping the problem data and previous iterates to cutting planes. We propose a CPL implementation to generate split cuts, and by combining several CPLs, we devise a differentiable cutting-plane algorithm that exploits the repeated nature of parametric instances. In an offline phase, we train our algorithm by updating the internal parameters controlling the CPLs, thus altering cut generation. Once trained, our algorithm computes, with predictable execution times and a fixed number of cuts, solutions with low integrality gaps. Preliminary computational tests show that our algorithm generalizes on unseen instances and captures underlying parametric structures.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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