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arXiv 2305.14554cond-mat.mtrl-sciphysics.app-ph
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通过无转移化学气相沉积实现TMDCs与预图案化器件架构的自底向上集成

Bottom-up Integration of TMDCs with Pre-Patterned Device Architectures via Transfer-free Chemical Vapor Deposition

Lucas M. Sassi, Sathvik Ajay Iyengar, Anand B. Puthirath, Yuefei Huang, Xingfu Li, Tanguy Terlier, Ali Mojibpour, Ana Paula C. Teixeira, Palash Bharadwaj, Chand… 展开作者

Lucas M. Sassi, Sathvik Ajay Iyengar, Anand B. Puthirath, Yuefei Huang, Xingfu Li, Tanguy Terlier, Ali Mojibpour, Ana Paula C. Teixeira, Palash Bharadwaj, Chandra Sekhar Tiwary, Robert Vajtai, Saikat Talapatra, Boris Yakobson, Pulickel M. Ajayan

AI总结:

本工作提出了一种无转移化学气相沉积方法,通过动力学主导的原位生长机制在Au和SiO2基底上生长WSe2,实现了TMDCs与预图案化器件架构的BEOL兼容集成,并成功制造出具有高迁移率、低亚阈值摆幅和高开关比的FET器件。

摘要:

二维(2D)过渡金属硫族化合物(TMDCs)依然备受关注。鉴于其较低的工作开关成本,它们在新型计算架构中具有许多利基应用,并有望实现持续的小型化。然而,当前晶体生长要求在BEOL(后端工艺)集成温度和时间合规性方面面临挑战。此外,有害且耗时的转移过程以及沟道/接触工程涉及的多个步骤会削弱器件性能。本工作展示了WSe2的动力学主导原位生长机制(从金表面的表面或边缘生长),并通过各种材料界面的能量学提供了对这些机制的理解。作为概念验证,制造了在Au接触上原位生长WSe2沟道的场效应晶体管(FET),在450-600 C、2小时时间窗口的BEOL集成要求内,通过无转移方法演示了2D半导体晶体管。我们利用定向边缘生长制造了具有稳健厚度依赖性的肖特基到欧姆行为的接触。通过在Au和SiO2生长基底之间原位切换,本工作在制造的FET中实现了应变诱导的140 mV/decade亚阈值摆幅、相对较高的107 ± 19 cm2V-1s-1迁移率以及稳健的10^6开/关比。

英文摘要:

Two-dimensional (2D) transition metal dichalcogenides (TMDCs) remain a topic of immense interest. Specifically, given their low operational switching costs, they find many niche applications in new computing architectures with the promise of continued miniaturization. However, challenges lie in Back End of Line (BEOL) integration temperature and time compliance regarding current requirements for crystal growth. Additionally, deleterious and time-consuming transfer processes and multiple steps involved in channel/contact engineering can cripple device performance. This work demonstrates kinetics-governed in-situ growth regimes (surface or edge growth from gold) of WSe2 and provides a mechanistic understanding of these regimes via energetics across various material interfaces. As a proof-of-concept, field effect transistors (FET) with an in-situ grown WSe2 channel across Au contacts are fabricated, demonstrating a 2D semiconductor transistor via a transfer-free method within the 450-600 C 2h-time window requirement BEOL integration. We leverage directional edge growth to fabricate contacts with robust thickness-dependent Schottky-to-Ohmic behavior. By transitioning between Au and SiO2 growth substrates in situ, this work achieves strain-induced subthreshold swing of 140 mV/decade, relatively high mobility of 107 +- 19 cm2V-1s-1, and robust ON/OFF ratios 10^6 in the fabricated FETs.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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