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arXiv 2104.08882cond-mat.mtrl-sci
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4 H- SiC中高剂量P离子注入的热退火

Thermal Annealing of High Dose P Implantation in 4H-SiC

Cristiano Calabretta, Massimo Zimbone, Eric G. Barbagiovanni, Simona Boninelli, Nico Piluso, Andrea Severino, Maria A. Di Stefano, Simona Lorenti, Lucia Calcagno, Francesco La Via

摘要:

在这项工作中,我们已经研究了晶体缺陷和掺杂激活离子注入和退火后,通过使用各种技术,包括光致发光(PL),拉曼光谱和透射电子显微镜(TEM)。本工作的目的是测试双步骤退火的有效性,以减少点缺陷的密度在退火过程中产生的P注入4 H-SiC外延层。该工作的结果证明,无论是在1650 - 1700 - 1750 °C下进行1小时等时退火的第一个,还是在1500 °C下进行4小时至14小时之间的时间的第二个,都不能恢复样品的令人满意的结晶度并实现超过1%的掺杂剂活化。

英文摘要:

In this work, we have studied the crystal defectiveness and doping activation subsequent to ion implantation and post-annealing by using various techniques including photoluminescence (PL), Raman spectroscopy and transmission electron microscopy (TEM). The aim of this work was to test the effectiveness of double step annealing to reduce the density of point defects generated during the annealing of a P implanted 4H-SiC epitaxial layer. The outcome of this work evidences that neither the first, 1 hour isochronal annealing at 1650 - 1700 - 1750 °C, nor the second one, at 1500 °C for times between 4 hour and 14 hour, were able to recover a satisfactory crystallinity of the sample and achieve dopant activations exceeding 1%.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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