Reduction of the inter-probe distance in multi-probe and double-tip STM down to the nanometer scale has been a longstanding and technically difficult challenge. Recent multi-probe systems have allowed for significant progress by achieving distances of around 30 nm using two individually driven, traditional metal wire tips. For situations where simple alignment and a fixed separation can be advantageous, we here present the fabrication of on-chip double-tip devices that incorporate two mechanically fixed gold tips with a tip separation of only 35 nm. We utilize the excellent mechanical, insulating and dielectric properties of high quality SiN as a base material to realize easy-to-implement, lithographically defined and mechanically stable tips. With their large contact pads and adjustable footprint these novel tips can be easily integrated with most existing commercial combined STM/AFM systems.
We report on the fabrication and performance of a new kind of tip for scanning tunneling microscopy. By fully incorporating a metallic tip on a silicon chip using modern micromachining and nanofabrication techniques, we realize so-called smart tips and show the possibility of device-based STM tips. Contrary to conventional etched metal wire tips, these can be integrated into lithographically defined electrical circuits. We describe a new fabrication method to create a defined apex on a silicon chip and experimentally demonstrate the high performance of the smart tips, both in stability and res…
We report fabrication of a multifunctional photonic integrated chip on lithium niobate on insulate (LNOI), which is achieved by femtosecond laser assisted chemo-mechanical polish. We demonstrate a high extinction ratio beam splitter, a 1 * 6 optical switch, and a balanced 3 * 3 interferometer on the fabricated chip by reconfiguring the microelectrode array integrated with the multifunctional photonic circuit.
Spin-polarized scanning tunneling microscopy (SP-STM) measures tunnel magnetoresistance (TMR) with atomic resolution. While various methods for achieving SP probes have been developed, each is limited with respect to fabrication, performance, and allowed operating conditions. In this study, we present the fabrication and use of SP-STM tips made from commercially available antiferromagnetic $\rm{Mn_{88}Ni_{12}}$ foil. The tips are intrinsically SP, which is attractive for exploring magnetic phenomena in the zero field limit. The tip material is relatively ductile and straightforward to etch. We…
With compact footprint, low energy consumption, high scalability, and mass producibility, chip-scale integrated devices are an indispensable part of modern technological change and development. Recent advances in two-dimensional (2D) layered materials with their unique structures and distinctive properties have motivated their on-chip integration, yielding a variety of functional devices with superior performance and new features. To realize integrated devices incorporating 2D materials, it requires a diverse range of device fabrication techniques, which are of fundamental importance to achiev…
We demonstrate a hybrid laser microfabrication approach, which combines the technical merits of ultrafast laser-assisted chemical etching and carbon dioxide laser-induced in-situ melting, for centimeter-scale and bonding-free fabrication of 3D complex hollow microstructures in fused silica glass. With the developed approach, large-scale fused silica microfluidic chips with integrated 3D cascaded micromixing units can be reliably manufactured. High-performance on-chip mixing and continuous-flow photochemical synthesis under UV LEDs irradiation at ~280 nm were demonstrated using the manufactured…
Efficient coupling of single quantum emitters to guided optical modes of integrated optical devices is of high importance for applications in quantum information science as well as in the field of sensing. Here we present the design and fabrication of a platform for on-chip experiments based on dielectric optical single-mode waveguides(Ta2O5 on SiO2). The design of the waveguide is optimized for broadband (600-800 nm) evanescent coupling to a single quantum emitter (expected efficiency: up to 36%) and efficient off-chip coupling to single-mode optical fibers using inverted tapers. First test s…
Microfluidics is an established multidisciplinary research domain with widespread applications in the fields of medicine, biotechnology and engineering. Conventional production methods of microfluidic chips have been limited to planar structures, preventing the exploitation of truly three-dimensional architectures for applications such as multi-phase droplet preparation or wet-phase fibre spinning. Here the challenge of nanofabrication inside a microfluidic chip is tackled for the showcase of a spider-inspired spinneret. Multiphoton lithography, an additive manufacturing method, was used to pr…
Nano-fabrication in silicon, arguably the most important material for modern technology, has been limited exclusively to its surface. Existing lithographic methods cannot penetrate the wafer surface without altering it, whereas emerging laser-based subsurface or in-chip fabrication remains at > 1 micrometer resolution. In addition, available methods do not allow positioning or modulation with sub-micron precision deep inside the wafer. The fundamental difficulty of breaking these dimensional barriers are two-fold, i.e., complex nonlinear effects inside the wafer and the inherent diffraction li…
We have realized a microstrip based THz near field cantilever which enables quantitative measurements of the impedance of the probe tip at THz frequencies (0.3 THz). A key feature is the on-chip balanced hybrid coupler which serves as an interferometer for passive signal cancellation to increase the readout circuit sensitivity despite extreme impedance mismatch at the tip. We observe distinct changes in the reflection coefficient of the tip when brought into contact with different dielectric (Si, SrTiO3) and metallic samples (Au). By comparing to finite element simulations we determine the sen…
Metal-halide perovskites are promising lasing materials for realization of monolithically integrated laser sources, the key components of silicon photonic integrated circuits (PICs). Perovskites can be deposited from solution and require only low temperature processing leading to significant cost reduction and enabling new PIC architectures compared to state-of-the-art lasers realized through costly and inefficient hybrid integration of III-V semiconductors. Until now however, due to the chemical sensitivity of perovskites, no microfabrication process based on optical lithography and therefore…
Miniaturized, low-cost wavelength detectors are gaining enormous interest as we step into the new age of photonics. Incompatibility with integrated circuits or complex fabrication requirement in most of the conventionally used filters necessitates the development of a simple, on-chip platform for easy-to-use wavelength detection system. Also, intensity fluctuations hinder precise, noise free detection of spectral information. Here we propose a novel approach of utilizing wavelength sensitive photocurrent across semiconductor heterojunctions to experimentally validate broadband wavelength detec…
Microfluidic chips provide unparalleled control over droplets and jets, which have advanced all natural sciences. However, microfluidic applications could be vastly expanded by increasing the per-channel throughput and directly exploiting the output of chips for rapid additive manufacturing. We unlock these features with in-air microfluidics, a new chip-free platform to manipulate microscale liquid streams in the air. By controlling the composition and in-air impact of liquid microjets by surface tension-driven encapsulation, we fabricate monodisperse emulsions, particles, and fibers with diam…
Integrating all optical components of an optical coherence tomography (OCT) device into a single chip is a non-trivial and a challenging job. The design and development of such a lab-on-a chip will be possible only via Micro-Opto-Electro-Mechanical System (MOEMS) technology. The reproducible and integrated optical device fabrication would reduce cost and size many fold as compared to bulk or fiber optic OCT system. A miniaturized OCT of size less than 5mm$^2$ area is designed, simulated and optimized. The successful fabrication of this device would help in point-of-contact devices as well as e…
Atomic force microscopy (AFM) is a powerful tool to investigate interaction forces at the micro and nanoscale. Cantilever stiffness, dimensions and geometry of the tip can be chosen according to the requirements of the specific application, in terms of spatial resolution and force sensitivity. Colloidal probes (CPs), obtained by attaching a spherical particle to a tipless (TL) cantilever, offer several advantages for accurate force measurements: tunable and well-characterisable radius; higher averaging capabilities (at the expense of spatial resolution) and sensitivity to weak interactions; a …
We present and investigate theoretically photonic integrated filters based on 2 Sagnac coupled loop reflectors (SLRs) that are arranged in a self-coupled optical waveguide. We recently presented photonic integrated filters based on coupled and cascaded SLRs. In this paper, we advance this field by investigating a unique approach of employing coupled SLRs formed by self-coupled waveguides. This allows us to achieve high performance filter functions including Fano-like resonances and wavelength interleaving with a simpler design and a higher fabrication tolerance by tailoring coherent mode inter…
The design and engineering of photonic architectures, suitable to enhance, collect and guide light on chip is needed for applications in quantum photonics and quantum optomechanics. In this work we apply a Faraday cage based oblique angle etch method to fabricate various functional photonic devices from 4H Silicon Carbide - a material that has attracted attention in recent years, due to its potential in optomechanics, nonlinear optics and quantum information. We detail the processing conditions and thoroughly address the geometrical and optical characteristics of the fabricated devices. Employ…
The most commonly used physical realization of superconducting qubits for quantum circuits is a transmon. There are a number of superconducting quantum circuits applications, where Josephson junction critical current reproducibility over a chip is crucial. Here, we report on a robust chip scale $Al/AlO_x/Al$ junctions fabrication method due to comprehensive study of shadow evaporation and oxidation steps. We experimentally demonstrate the evidence of optimal Josephson junction electrodes thickness, deposition rate and deposition angle, which ensure minimal electrode surface and line edge rough…
The light output of deep ultraviolet (UV-C) AlGaN light-emitting diodes (LEDs) is limited due to their poor light extraction efficiency (LEE). To improve the LEE of AlGaN LEDs, we developed a fabrication technology to process AlGaN LEDs grown on SiC into thin-film flip-chip LEDs (TFFC LEDs) with high LEE. This process transfers the AlGaN LED epi onto a new substrate by wafer-to-wafer bonding, and by removing the absorbing SiC substrate with a highly selective SF6 plasma etch that stops at the AlN buffer layer. We optimized the inductively coupled plasma (ICP) SF6 etch parameters to develop a s…
With recent advances in dynamic scanning probe microscopy techniques, it is now a routine to image the sub-molecular structure of molecules with atomically-engineered tips which are prepared via controlled modification of the tip termination and are chemically well-defined. The enhanced spatial resolution is possible as atomically-engineered tips can preserve their integrity in the repulsive interaction regime. Although the mechanism of improved spatial resolution has been investigated both experimentally and theoretically, the ultimate temporal resolution while preserving picometer scale spat…
We demonstrate fabrication of a high quality factor lithium niobate double-disk whispering-gallery microcavity using femtosecond laser assisted ion beam milling. Using this method, two vertically stacked 30-um-diameter disks with a 200-nm-gap are fabricated. With our device, an optical quality factor as high as 1.2*10^5 is demonstrated. Our approach is scalable to fabricate multiple disks on a single chip.
We introduce a simplified fabrication technique for Josephson junctions and demonstrate superconducting Xmon qubits with $T_1$ relaxation times averaging above 50$~μ$s ($Q>$1.5$\times$ 10$^6$). Current shadow-evaporation techniques for aluminum-based Josephson junctions require a separate lithography step to deposit a patch that makes a galvanic, superconducting connection between the junction electrodes and the circuit wiring layer. The patch connection eliminates parasitic junctions, which otherwise contribute significantly to dielectric loss. In our patch-integrated cross-type (PICT) juncti…
The need for rapid fabrication of microfluidic devices has become increasingly critical as microfluidics become part of biomedical sensors. Using Warp and Weft Wiring (WWW) of copper wires, this paper presents a novel low-cost method for rapid, self-aligned, bonding-free, and modifiable fabrication of multi-electrodes microfluidic sensors. All the proposed features are promising and highly recommended for the development of Point-of-Care Tests (POCTs), while most of the conventional methods have low chances of coming out of the research labs and play no role in POCTs development. To have an ex…
As a derivative of graphene, graphene oxide (GO) was initially developed by chemists to emulate some of the key properties of graphene, but it was soon recognized as a unique material in its own right, addressing an application space that is not accessible to chemical vapor deposition based materials. Over the past decade, GO has emerged as a new frontier material with tremendous advances in its material fabrication and quality control over its properties. These in turn have led to rapid progress in GO based photonics, electronics, and optoelectronics concepts and devices, evoking new science …
A novel technique is presented for realising programmable silicon photonic circuits. Once the proposed photonic circuit is programmed, its routing is retained without the need for additional power consumption. This technology enables a uniform multi-purpose design of photonic chips for a range of different applications and performance requirements, as it can be programmed for each specific application after chip fabrication. Therefore the cost per chip can be dramatically reduced because of the increase in production volume, and rapid prototyping of new photonic circuits is enabled. Essential …
