Optimization of an area detector involves compromises between various parameters like frame rate, read noise, dynamic range and pixel size. We have implemented and tested a novel front-end binning design in a photon-integrating hybrid pixel array detector using the MM-PAD-2.0 pixel architecture. In this architecture, the pixels can be optionally binned in a 2$\times$2 pixel configuration using a network of switches to selectively direct the output of 4 sensor pixels to a single amplifier input. Doing this allows a trade-off between frame rate and spatial resolution. Tests show that the binned pixels perform well, but with some degradation on performance as compared to an un-binned pixel. The increased parasitic input capacitance does reduce the signal collected per x-ray as well as increases the noise of the pixel. The increase in noise is, however, less than the factor of 2 increase one would observe for binning in post-processing. Spatial scans across the binned pixels show that no measured signal intensity is lost at the inner binning unit boundaries. In the high flux regime, at a 2$\times$2 pixel wide beam spot (FWHM) size, binned mode responds linearly up to a photon flux of ~10$^{7}$ x-rays/s, and performs comparably with un-binned mode up to a photon flux of ~10$^{8}$ x-rays/s. While this study demonstrates a proof of concept for front-end binning in integrating detectors, we also identify changes to this early-stage prototype which can further improve the performance of binning pixel structures.
We present a design improvement for a recently proposed type of Shack-Hartmann wavefront sensor that uses a cylindrical (lenticular) lenslet array. The improved sensor design uses optical binning and requires significantly fewer detector pixels than the corresponding conventional or cylindrical Shack-Hartmann sensor, and so detector readout noise causes less signal degradation. Additionally, detector readout time is significantly reduced, which reduces the latency for closed loop systems, and data processing requirements. We provide simple analytical noise considerations and Monte-Carlo simula…
For the ATLAS Pixel Detector fast readout electronics has been successfully developed and tested. Main attention was given to the ability to detect small charges in the order of 5,000 electrons within 25 ns in the harsh radiation environment of LHC together with the challenge to cope with the huge amount of data generated by the 80 millions channels of the Pixel detector. For the integration of the 50 micron pitch hybrid pixel detector reliable bump bonding techniques using either lead-tin or indium bumps has been developed and has been successfully tested for large scale production.
In this work we investigated a method to determine time walk in an active silicon pixel sensor prototype using Edge-TCT with infrared laser charge injection. Samples were investigated before and after neutron irradiation to 5e14 neq/cm2. Threshold, noise and calibration of the analogue front end were determined with external charge injection. A spatially sensitive measurement of collected charge and time walk was carried out with Edge-TCT, showing a uniform charge collection and output delay in pixel centre. On pixel edges charge sharing was observed due to finite beam width resulting in small…
High-rate, high-resolution single photon X-ray imaging: Medipix4, a large 4-side buttable pixel readout chip with high granularity and spectroscopic capabilities
As we have seen for digital camera market and a sensor resolution increasing to "megapixels", all the scientific and high-tech imagers (whatever the wave length - from radio to X-ray range) tends also to always increases the pixels number. So the constraints on front-end signals transmission increase too. An almost unavoidable solution to simplify integration of large arrays of pixels is front-end multiplexing. Moreover, "simple" and "efficient" techniques allow integration of read-out multiplexers in the focal plane itself. For instance, CCD (Charge Coupled Device) technology has boost number…
Several charge integrating CMOS pixel front-ends utilizing charge removal techniques have been fabricated to extend dynamic range for x-ray diffraction applications at synchrotron sources and x-ray free electron lasers (XFELs). The pixels described herein build on the Mixed Mode Pixel Array Detector (MM-PAD) framework, developed previously by our group to perform high dynamic range imaging. These new pixels boast several orders of magnitude improvement in maximum flux over the MM-PAD, which is capable of measuring a sustained flux in excess of 10$^{8}$ x-rays/pixel/second while maintaining sen…
The ATLAS Collaboration will upgrade its semiconductor pixel tracking detector with a new Insertable B-layer (IBL) between the existing pixel detector and the vacuum pipe of the Large Hadron Collider. The extreme operating conditions at this location have necessitated the development of new radiation hard pixel sensor technologies and a new front-end readout chip, called the FE-I4. Planar pixel sensors and 3D pixel sensors have been investigated to equip this new pixel layer, and prototype modules using the FE-I4A have been fabricated and characterized using 120 GeV pions at the CERN SPS and 4…
A new module concept for future ATLAS pixel detector upgrades is presented, where thin n-in-p silicon sensors are connected to the front-end chip exploiting the novel Solid Liquid Interdiffusion technique (SLID) and the signals are read out via Inter Chip Vias (ICV) etched through the front-end. This should serve as a proof of principle for future four-side buttable pixel assemblies for the ATLAS upgrades, without the cantilever presently needed in the chip for the wire bonding. The SLID interconnection, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. …
This paper presents a small-area monolithic pixel detector ASIC designed in 130 nm SiGe BiCMOS technology for the upgrade of the pre-shower detector of the FASER experiment at CERN. The purpose of this prototype is to study the integration of fast front-end electronics inside the sensitive area of the pixels and to identify the configuration that could satisfy at best the specifications of the experiment. Self-induced noise, instabilities and cross-talk were minimised to cope with the several challenges associated to the integration of pre-amplifiers and discriminators inside the pixels. The m…
We have studied the performance of two different types of front-end systems for our gamma camera based on Hamamatsu H8500 (flat-panel 64 channels multi-anode PSPMT) with a CsI(Tl) scintillator array. The array consists of 64 pixels of $6\times6\times20{\rm mm}^3$ which corresponds to the anode pixels of H8500. One of the system is based on commercial ASIC chips in order to readout every anode. The others are based on resistive charge divider network between anodes to reduce readout channels. In both systems, each pixel (6mm) was clearly resolved by flood field irradiation of $^{137}$Cs. We als…
A characterisation of the Timepix4 pixel front-end with a strong focus on timing performance is presented. Externally generated test pulses were used to probe the per-pixel time-to-digital converter (TDC) and measure the time-bin sizes by precisely controlling the test-pulse arrival time in steps of 10 ps. The results indicate that the TDC can achieve a time resolution of 60 ps, provided that a calibration is performed to compensate for frequency variation in the voltage controlled oscillators of the pixel TDCs. The internal clock distribution system of Timepix4 was used to control the arrival…
This work presents the first measurements performed on the Timespot1 ASIC. As the second prototype developed for the TimeSPOT project, the ASIC features a 32x32 channels hybrid-pixel matrix. Targeted to space-time tracking applications in High Energy Physics experiments, the system aims to achieve a time resolution of 30 ps or better at a maximum event rate of 3 MHz per channel with a Data Driven interface. Power consumption can be programmed to range between $1.2W/cm^{2}$ and $2.6W/cm^{2}$. The presented results include a description of the ASIC operation and a first characterization of its p…
Cadmium zinc telluride (CdZnTe, CZT) radiation detectors are suitable for a variety of applications, due to their high spatial resolution and spectroscopic energy performance at room temperature. However, state-of-the-art detector systems require high-performance readout electronics. Though an application-specific integrated circuit (ASIC) is an adequate solution for the readout, requirements of high dynamic range and high throughput are not available in any commercial circuit. Consequently, the present study develops the analog front-end electronics with operational amplifiers for an 8x8 pixe…
Exoplanetary transit and stellar oscillation surveys require a very high precision photometry. The instrumental noise has therefore to be minimized. First, we perform a semi-analytical model of different noise sources. We show that the noise due the CCD electrodes can be overcome using a Gaussian PSF (Point Spread Function) of full width half maximum larger than 1.6 pixels. We also find that for a PSF size of a few pixels, the photometric aperture has to be at least 2.5 times larger than the PSF full width half maximum. Then, we compare a front- with a back-illuminated CCD through a Monte-Carl…
Pixelated PET systems produce higher count rates as they integrate several detecting channels per detector module. An increased data flow from the detectors posses higher needs on the bandwidth requirements. We aim to optimize the bandwidth usage efficiency by filtering on the fly the detected events with non valid energies. PET systems with a SiPM-ASIC readout scheme are being extensively used to get enhanced images on Time-Of-Flight PET scanners. These kind of digital readout systems are specially interesting for the application of on-line processing techniques given the ease of access to ea…
A monolithic pixelated silicon detector designed for high time resolution has been produced in the SG13G2 130 nm SiGe BiCMOS technology of IHP Mikroelektronik. This proof-of-concept chip contains hexagonal pixels of 65 μm and 130 μm side. The SiGe front-end electronics implemented provides an equivalent noise charge of 90 and 160 electrons for a pixel capacitance of 70 and 220 fF, respectively, and a total time walk of less than 1 ns. Lab measurements with a 90Sr source show a time resolution of the order of 50 ps. This result is competitive with silicon technologies that integrate an avalanch…
The CMS Inner Tracker, made of silicon pixel modules, will be entirely replaced prior to the start of the High Luminosity LHC period. One of the crucial components of the new Inner Tracker system is the readout chip, being developed by the RD53 Collaboration, and in particular its analogue front-end, which receives the signal from the sensor and digitizes it. Three different analogue front-ends (Synchronous, Linear, and Differential) were designed and implemented in the RD53A demonstrator chip. A dedicated evaluation program was carried out to select the most suitable design to build a radiati…
The innermost part of the ATLAS experiment will be a pixel detector containing around 1750 individual detector modules. A detector control system (DCS) is required to handle thousands of I/O channels with varying characteristics. The main building blocks of the pixel DCS are the cooling system, the power supplies and the thermal interlock system, responsible for the ultimate safety of the pixel sensors. The ATLAS Embedded Local Monitor Board (ELMB), a multi purpose front end I/O system with a CAN interface, is foreseen for several monitoring and control tasks. The Supervisory, Control And Data…
In July 2018 an optimization run for the proposed charm cross section measurement for SHiP was performed at the CERN SPS. A heavy, moving target instrumented with nuclear emulsion films followed by a silicon pixel tracker was installed in front of the Goliath magnet at the H4 proton beamline. Behind the magnet, scintillating-fibre, drift-tube and RPC detectors were placed. The purpose of this run was to validate the measurement's feasibility, to develop the required analysis tools and fine-tune the detector layout. In this paper, we present the track reconstruction in the pixel tracker and the…
A hard x-ray, high-speed, high dynamic range scientific x-ray imager is described. The imager is based on the mixed-mode pixel array detector (MM-PAD) readout chip coupled to a 750 micron thick cadmium telluride (CdTe) sensor. The full imager is a 2 x 3 tiled array of MM-PAD sensor/readout chip hybrids. CdTe improves detection for high energy x-rays as compared to silicon sensors, enabling efficient x-ray imaging to extend to >100 keV. The detector is capable of 1 kHz imaging and in-pixel circuitry has been designed to allow for well depths of greater than 4 x 10^{6} 80 keV x-rays. A charge in…
Diamond has been developed as a material for the detection of charged particles by ionization. Its radiation hardness makes it an attractive material for detectors operated in a harsh radiation environment e.g. close to a particle beam as is the case for beam monitoring and for pixel vertex detectors. Poly-crystalline chemical vapor deposition (CVD) diamond has been studied as strip and pixel detectors so far. We report on a first-time characterization of a single-crystal diamond pixel detector in a 100 GeV particle beam at CERN. The detectors are made from irregularly shaped single crystal se…
Most optical and IR spectra are now acquired using detectors with finite-width pixels in a square array. This paper examines the effects of such pixellation, using computed simulations to illustrate the effects which most concern the astronomer end-user. Coarse sampling increases the random noise errors in wavelength by typically 10 - 20% at 2 pixels/FWHM, but with wide variation depending on the functional form of the instrumental Line Spread Function (LSF) and on the pixel phase. Line widths are even more strongly affected at low sampling frequencies. However, the noise in fitted peak amplit…
We have operated a Medipix2 CMOS readout chip, with amplifying, shaping and charge discriminating front-end electronics integrated on the pixel-level, as a highly segmented direct charge collecting anode in a three-stage gas electron multiplier (Triple-GEM) to detect the ionization from $^{55}$Fe X-rays and electrons from $^{106}$Ru. The device allows to perform moderate energy spectroscopy measurements (20 % FWHM at 5.9 keV $X$-rays) using only digital readout and two discriminator thresholds. Being a truly 2D-detector, it allows to observe individual clusters of minimum ionizing charged part…
The proposed Circular Electron Positron Collider (CEPC) imposes new challenges for the vertex detector in terms of high resolution, low material, fast readout and low power. The Monolithic Active Pixel Sensor (MAPS) technology has been chosen as one of the most promising candidates to satisfy these requirements. A MAPS prototype, called TaichuPix1, based on a data-driven structure, together with a column drain readout architecture, benefiting from the ALPIDE and FE-I3 approaches, has been implemented to achieve fast readout. This paper presents the overall architecture of TaichuPix1, the exper…
3D silicon detectors are characterized by cylindrical electrodes perpendicular to the surface and penetrating into the bulk material in contrast to standard Si detectors with planar electrodes on its top and bottom. This geometry renders them particularly interesting to be used in environments where standard silicon detectors have limitations, such as for example the radiation environment expected in an LHC upgrade. For the first time, several 3D sensors were assembled as hybrid pixel detectors using the ATLAS-pixel front-end chip and readout electronics. Devices with different electrode confi…
This paper outlines the results of investigations into the effects of radiation damage in the mini-MALTA prototype. Measurements were carried out at Diamond Light Source using a micro-focus X-ray beam, which scanned across the surface of the device in 2 $\mathrm{μm}$ steps. This allowed the in-pixel photon response to be measured directly with high statistics. Three pixel design variations were considered: one with the standard continuous $\mathrm{n^-}$ layer layout and front-end, and extra deep p-well and $\mathrm{n^-}$ gap designs with a modified front-end. Five chips were measured: one unir…
Detectors based on pixels with timing capabilities are gaining increasing importance in the last years. Next-to-come high-energy physics experiments at colliders require the use of time information in tracking, due to the expected levels of track densities in the foreseen experimental conditions. A promising solution to gain high-resolution performance at the sensor level is given by so-called 3D silicon sensors. The excellent intrinsic time resolution of a special case of 3D sensors, the trench type, is limited by residual non-uniformities in the duration of the induced currents. The intrinsi…
A new pixel detector for the CMS experiment is being built, owing to the instantaneous luminosities anticipated for the Phase I Upgrade of the LHC. The new CMS pixel detector provides four-hit tracking while featuring a significantly reduced material budget as well as new cooling and powering schemes. A new front-end readout chip mitigates buffering and bandwidth limitations, and comprises a low-threshold comparator. These improvements allow the new pixel detector to sustain and improve the efficiency of the current pixel tracker at the increased requirements imposed by high luminosities and p…
The proof-of-concept prototype of the Picosecond Avalanche Detector, a multi-PN junction monolithic silicon detector with continuous gain layer deep in the sensor depleted region, was tested with a beam of 180 GeV pions at the CERN SPS. The prototype features low noise and fast SiGe BiCMOS frontend electronics and hexagonal pixels with 100 μm pitch. At a sensor bias voltage of 125 V, the detector provides full efficiency and average time resolution of 30, 25 and 17 ps in the overall pixel area for a power consumption of 0.4, 0.9 and 2.7 W/cm^2, respectively. In this first prototype the time re…
Upgrade of the Belle II Vertex Detector with Depleted Monolithic CMOS Active Pixel Sensors
Marietta Blau Institute for Particle Physics, Austrian Academy of Sciences（玛丽亚·布劳粒子物理研究所，奥地利科学院）；Department of Engineering and Applied Sciences, University of Bergamo（贝加莫大学工程与应用科学学院）；Department of Electrical, Computer and Biomedical Engineering, University of Pavia（帕维亚大学电气、计算机和生物医学工程系）；Dipartimento di Fisica “E. Fermi”, Università di Pisa（比萨大学“E. 费米”物理系）；INFN Sezione di Pisa（意大利国家核物理研究所比萨分部）；Aix Marseille Univ, CNRS IN2P3, CPPM（艾克斯-马赛大学，法国国家科学研究中心，法国国家核物理与粒子物理研究所，普罗旺斯粒子物理中心）；Laboratoire de Physique des 2 infinis Irène Joliot-Curie – IJCLab, Université Paris-Saclay, CNRS IN2P3（巴黎-萨克雷大学，法国国家科学研究中心，法国国家核物理与粒子物理研究所，伊雷娜·约里奥-居里双无限物理实验室）；Université de Strasbourg, CNRS, IPHC UMR 7178（斯特拉斯堡大学，法国国家科学研究中心，高能物理研究所）；Physikalisches Institut, Rheinische（莱茵（威斯特法伦）联邦工业大学物理学院）
Belle II实验为应对更高的亮度，计划升级顶点探测器，采用耗尽单片主动像素传感器，设计高辐射容忍度和低功耗性能。
The RICH detectors of the LHCb experiment provide identification of hadrons produced in high energy proton-proton collisions in the LHC at CERN over a wide momentum range (2 to 100 GeV/c). Cherenkov light is collected on photon detector planes sensitive to single photons. The RICH will be upgraded (in 2019) to read out every bunch crossing, at a rate of 40 MHz. The current hybrid photon detectors (HPD) will be replaced with multi-anode photomultiplier tubes (customisations of the Hamamatsu R11265 and the H12699 MaPMTs). These 8$\times$8 pixel devices meet the experimental requirements thanks t…
The MALTA family of Depleted Monolithic Active Pixel Sensor (DMAPS) produced in Tower 180 nm CMOS technology targets radiation hard applications for the HL-LHC and beyond. Several process modifications and front-end improvements have resulted in radiation hardness up to $2 \times 10^{15}~1~\text{MeV}~\text{n}_{eq}/\text{cm}^2$ and time resolution below 2 ns, with uniform charge collection efficiency across the Pixel of size $36.4 \times 36.4~μ\text{m}^2$ with a $3~μ\text{m}^2$ electrode size. The MALTA2 demonstrator produced in 2021 on high-resistivity epitaxial silicon and on Czochralski subs…
The ATLAS Insertable B-Layer (IBL) collaboration plans to insert a fourth pixel layer inside the present Pixel Detector to recover from eventual failures in the current pixel system, especially the b-layer. Additionally the IBL will ensure excellent tracking, vertexing and b-tagging performance during the LHC phase I and add robustness in tracking with high luminosity pile-up. The expected peak luminosity for IBL is 2 to 3centerdot1034 cm-2s-1 and IBL is designed for an integrated luminosity of 700 fb-1. This corresponds to an expected fluence of 5centerdot1015 1 MeV neqcm-2 and a total ionizi…
Gotthard-II is a silicon microstrip detector developed for the European X-ray Free-Electron Laser (XFEL.EU). Its potential scientific applications include X-ray absorption/emission spectroscopy, hard X-ray high resolution single-shot spectrometry (HiREX), energy dispersive experiments at 4.5 MHz frame rate, beam diagnostics, as well as veto signal generation for pixel detectors. Gotthard-II uses a silicon microstrip sensor with a pitch of 50 $μ$m or 25 $μ$m and with 1280 or 2560 channels wire-bonded to readout chips (ROCs). In the ROC, an adaptive gain switching pre-amplifier (PRE), a fully di…
We present the development of a single-photon detector and the connected read-out electronics. This `hybrid' detector is based on a vacuum tube, transmission photocathode, microchannel plate and a pixelated CMOS read-out anode encapsulating the analog and digital-front end electronics. This assembly will be capable of detecting up to $10^9$ photons per second with simultaneous measurement of position and time. The pixelated read-out anode used is based on the Timepix4 ASIC ($65~\mathrm{nm}$ CMOS technology) designed in the framework of the Medipix4 collaboration. This ASIC is an array of $512\…
For the Belle II experiment at KEK (Tsukuba, Japan) the KEKB accelerator was upgraded to deliver a 40 times larger instantaneous luminosity than before, which requires an increased radiation hardness of the detector components. As the innermost part of the Belle II detector, the pixel detector (PXD), based on DEPFET (DEpleted P-channel Field Effect Transistor) technology, is most exposed to radiation from the accelerator. An irradiation campaign was performed to verify that the PXD can cope with the expected amount of radiation. We present the results of this measurement campaign in which an X…
Depleted Monolithic Active Pixel Sensors (DMAPS) constitute a promising low cost alternative for the outer layers of the ATLAS experiment Inner Tracker (ITk). Realizations in modern, high resistivity CMOS technologies enhance their radiation tolerance by achieving substantial depletion of the sensing volume. Two DMAPS prototypes that use the same "column-drain" readout architecture and are based on different sensor implementation concepts named LF-Monopix and TJ-Monopix have been developed for the High Luminosity upgrade of the Large Hardon Collider (HL-LHC). LF-Monopix was fabricated in the L…
Two different depleted monolithic CMOS active pixel sensor (DMAPS) prototypes with a fully synchronous column-drain read-out architecture were designed and tested: LF-Monopix and TJ-Monopix. These chips are part of a R&D effort towards a suitable implementation of a CMOS DMAPS for the HL-LHC ATLAS Inner Tracker. LF-Monopix was developed using a 150nm CMOS process on a highly resistive substrate (>2 k$Ω\,$cm), while TJ-Monopix was fabricated using a modified 180 nm CMOS process with a 1 k$Ω\,$cm epi-layer for depletion. The chips differ in their front-end design, biasing scheme, pixel pitch, di…
3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200um, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110um to 150um. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELE…
We present results of the detailed study of several hundred Hamamatsu H12700 Multianode Photomultiplier Tubes (MaPMTs), characterizing their response to the Cherenkov light photons in the second Ring Imaging Cherenkov detector, a part of the CLAS12 upgrade at Jefferson Lab. The total number of pixels studied was 25536. The single photoelectron spectra were measured for each pixel at different high voltages and light intensities of the laser test setup. Using the same dedicated front-end electronics as in the first RICH detector, the setup allowed us to characterize each pixel's properties such…
The CLIC Tracker Detector (CLICTD) is a monolithic pixelated sensor chip produced in a $180$ nm imaging CMOS process built on a high-resistivity epitaxial layer. The chip, designed in the context of the CLIC tracking detector study, comprises a matrix of ${16\times128}$ elongated pixels, each measuring ${300\times30}$ $μ$m$^2$. To ensure prompt charge collection, every elongated pixel is segmented in eight sub-pixels, each containing a collection diode and a separate analog front-end. A simultaneous $8$-bit time measurement with $10$ ns time bins and $5$-bit energy measurement with programmabl…
The CMS Phase-1 pixel detector was extracted from the underground cavern after the end of the LHC Run-2 in 2019 and has been kept cold to protect the silicon sensors during the long shutdown period (LS2) in 2019-2021. The LHC is now preparing for the next installment of the data taking beginning 2022. The Phase-1 pixel detector is scheduled to be installed this year and is going through a series of refurbishment and repairs to improve the quality of the collected data and enhance the operational experience. The innermost barrel layer has been replaced with new modules and features improved rea…
The ATLAS Pixel detector is a high-resolution, low-noise silicon-based device designed to provide tracking and vertexing information within a distance of 12 cm from the LHC beam axis. It consists of approximately 80 million pixel channels with radiation-hard front-end electronics connected through optical fibers to a custom-controlled DAQ system away from the detector. Following the successful installation of the detector in June 2007, an intense commissioning period was conducted in the year 2008 and more than 400,000 cosmic-ray tracks were recorded in conjunction with other ATLAS sub-detecto…
Microwave Kinetic Inductance Detectors (MKIDs) are the most attractive radiation detectors for far-infrared and sub-mm astronomy: They combine ultimate sensitivity with the possibility to create very large detector arrays, in excess of 10 000 pixels. This is possible by reading-out the arrays using RF frequency division multiplexing, which allows multiplexing ratios in excess of 1000 pixels per readout line. We describe a novel readout system for large arrays of MKIDs, operating in a 2 GHz band in the 4-8 GHz range. The readout, which is a combination of a digital front- and back-end and an an…
Test-beam results from MiniCACTUS-v2: A depleted monolithic CMOS timing sensor prototype
Institute for High Energy Physiscs (IFAE) Campus Autonomous University of Barcelona (UAB)（巴塞罗那自治大学高能物理研究所）；Autonomous University of Barcelona (UAB)（巴塞罗那自治大学）；Catalan Institution for Research and Advanced Studies (ICREA)（加泰罗尼亚研究与高级研究学院）；University of Liverpool（利物浦大学）
We present a cryogenic wafer mapper based on light emitting diodes (LEDs) for spatial mapping of a large microwave kinetic inductance detector (MKID) array. In this scheme, an array of LEDs, addressed by DC wires and collimated through horns onto the detectors, is mounted in front of the detector wafer. By illuminating each LED individually and sweeping the frequency response of all the resonators, we can unambiguously correspond a detector pixel to its measured resonance frequency. We have demonstrated mapping a 76.2 mm 90-pixel MKID array using a mapper containing 126 LEDs with 16 DC bias wi…
The Belle II experiment currently under construction at the $e^+e^-$-collider SuperKEKB in Japan is designed to explore new physics beyond the standard model with an approximately 50 times larger data sample compared to its predecessor. The vertex detector (VXD), comprising a two layer DEPFET pixel detector (PXD) surrounded by four layers of double sided silicon strip detector (SVD), is indispensable for the accurate determination of the decay point of $B$ or $D$ meson as well as track reconstruction of low momentum particles. The DEPFET sensors in Belle II are thinned down to 75 $μ$m with low…
In the hard X rays domain, the phase shift of the wave passing through the soft materials like tissues is typically three orders of magnitude larger than the absorption. Therefore the phase-sensitive X-ray imaging methods can obtain substantially increased contrast over conventional absorption-based imaging. In this paper, we present a detector system design for the computed tomography(CT) prototype which based on the grating-based phase contrast imaging(GBPCI) method. This system consists of 43 Hamamatsu silicon photodiode S12058(X) modules including 16512 pixels. Each module can provide 384(…
We present a readout chip prototype for future pixel detectors with timing capabilities. The prototype is intended for characterizing 4D pixel arrays with a pixel size of $100\times100~μ\text{m}^2$, where the sensors are Low Gain Avalanche Diodes (LGADs). The long-term focus is towards a possible replacement of disks in the extended forward pixel system (TEPX) of the CMS experiment during the High Luminosity LHC (HL-LHC). The requirements for this ASIC are the incorporation of a Time to Digital Converter (TDC) within each pixel, low power consumption, and radiation tolerance up to $5\times10^{…
An Application Specific Integrated Circuit (ASIC), called RIGEL, designed for the sparse readout of a Silicon Pixel Drift Detector (PixDD) for space applications is presented.The low leakage current (less than 1 pA at +20 °C) and anode capacitance (less than 40 fF) of each pixel (300 um x 300 um) of the detector, combined with a low-noise electronics readout, allow to reach a high spectroscopic resolution performance even at room temperature. The RIGEL ASIC front-end architecture is composed by a 2-D matrix of 128 readout pixel cells (RPCs), arranged to host, in a 300 um-sided square area, a c…
We discuss a new class of Micro Pattern Gas Detectors, the Gas Pixel Detector (GPD), in which a complete integration between the gas amplification structure and the read-out electronics has been reached. An Application-Specific Integrated Circuit (ASIC) built in deep sub-micron technology has been developed to realize a monolithic device that is, at the same time, the pixelized charge collecting electrode and the amplifying, shaping and charge measuring front-end electronics. The CMOS chip has the top metal layer patterned in a matrix of 80 micron pitch hexagonal pixels, each of them directly …
