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arXiv 1910.09448cond-mat.mes-hall
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亚开尔文温度下金属薄膜的动态热弛豫

Dynamic thermal relaxation in metallic films at sub-kelvin temperatures

L. B. Wang, D. S. Golubev, Y. M. Galperin, J. P. Pekola

摘要:

利用热效应的低温探测器的性能取决于其能量弛豫特性。通常,介观结构中的热传输实验是在稳态下进行的,其中温度梯度不随时间变化。在这里,我们提出了一个介观系统-薄金属膜的动态热弛豫的实验研究。我们发现,热电子在铜和银薄膜的热弛豫的特点是由几个时间常数,和薄膜的退火改变他们。在大多数情况下,观察到两个时间常数,我们可以通过引入一个额外的热库耦合到薄膜电子的系统模型。我们确定这个水库的比热及其与电子的耦合。实验表明,晶粒结构对金属薄膜中电子热弛豫的重要性。

英文摘要:

The performance of low temperature detectors utilizing thermal effects is determined by their energy relaxation properties. Usually, heat transport experiments in mesoscopic structures are carried out in the steady-state, where temperature gradients do not change in time. Here, we present an experimental study of dynamic thermal relaxation in a mesoscopic system -- thin metallic film. We find that the thermal relaxation of hot electrons in copper and silver films is characterized by several time constants, and that the annealing of the films changes them. In most cases, two time constants are observed, and we can model the system by introducing an additional thermal reservoir coupled to the film electrons. We determine the specific heat of this reservoir and its coupling to the electrons. The experiments point at the importance of grain structure on the thermal relaxation of electrons in metallic films.

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