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arXiv 1809.09013cond-mat.mes-hall
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28-nm FDSOI CMOS工艺在低温下的表征和建模

Characterization and Modeling of 28-nm FDSOI CMOS Technology down to Cryogenic Temperatures

Arnout Beckers, Farzan Jazaeri, Heorhii Bohuslavskyi, Louis Hutin, Silvano De Franceschi, Christian Enz

摘要:

本文提出了一个广泛的表征和建模的商业28纳米FDSOI CMOS工艺工作到低温。讨论了影响该技术的重要低温现象。采用面向设计的EKV模型,在较宽的温度范围(室温至4.2K)内模拟了包括体偏置在内的低温传输特性。利用最近提出的一种基于输出电导的方法,分别从低至1.4K和4.2K的直流测量中提取了长、短窄器件中自由载流子迁移率随温度的变化趋势.在长pMOS上观察到低温诱导的迁移率退化,导致空穴迁移率最大值约为77.K.这项工作为准备具有基于物理的低温紧凑模型的工业设计套件奠定了基础,这是FDSOI CMOS电路与在深低温温度下工作的硅量子位成功共集成的先决条件。

英文摘要:

This paper presents an extensive characterization and modeling of a commercial 28-nm FDSOI CMOS process operating down to cryogenic temperatures. The important cryogenic phenomena influencing this technology are discussed. The low-temperature transfer characteristics including body-biasing are modeled over a wide temperature range (room temperature down to 4.2\,K) using the design-oriented simplified-EKV model. The trends of the free-carrier mobilities versus temperature in long and short-narrow devices are extracted from dc measurements down to 1.4\,K and 4.2\,K respectively, using a recently-proposed method based on the output conductance. A cryogenic-temperature-induced mobility degradation is observed on long pMOS, leading to a maximum hole mobility around 77\,K. This work sets the stage for preparing industrial design kits with physics-based cryogenic compact models, a prerequisite for the successful co-integration of FDSOI CMOS circuits with silicon qubits operating at deep-cryogenic temperatures.

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