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arXiv 1509.04787cond-mat.mtrl-scicond-mat.stat-mech
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Cu2O电沉积中的基底效应和扩散控制粗化

Substrate effects and diffusion dominated roughening in Cu2O electrodeposition

I. S. Brandt, V. C. Zoldan, V. Stenger, C. C. Pla Cid, A. A. Pasa, T. J. Oliveira, F. D. A. Aarao Reis

摘要:

室温下,在n-Si(100)和Ni/n-Si(100)衬底上电沉积了25 ~ 1500 nm的Cu 2 O薄膜。X射线衍射和透射电镜分析表明,衬底的选择对Cu 2 O的结构和形貌有很大的影响,在n-Si(100)和Ni/n-Si(100)衬底上,Cu 2 O分别呈V形和U形柱状生长。原子力显微镜显示在这两种情况下,在表面的圆形颗粒的存在。在n-Si和Ni上生长的薄膜中分别观察到异常和正常的粗糙化,但标度指数的估计是不确定的。另一方面,局部高度,粗糙度和极值高度的分布显示出良好的一致性的Mullins和Herring(MH)的四阶线性随机方程。因此,在这两个系统中的表面动力学是由吸附的分子的扩散,没有大规模的可能的不均匀性的质量通量从溶液或反应和吸附速率的影响。在n-Si衬底上生长时,MH方程的噪声幅度随时间增加,而曲率相关项的系数与时间无关。台阶边缘能垒限制了穿过晶界的质量通量,因此初始晶粒的宽尺寸分布导致较大晶粒的粗化。这解释了它们在最厚的膜中的V形,并与异常粗糙化建立了联系。这些影响在Ni/n-Si上生长的膜中减少,其最初具有更大的晶粒,具有更窄的尺寸分布,因此,粗晶粒生长速率的波动较小。

英文摘要:

Cuprous oxide (Cu2O) films from 25 nm to 1500 nm were electrodeposited on n-Si(100) and Ni/n-Si(100) substrates from aqueous solution at room temperature. X-ray diffraction and transmission electron microscopy imaging show that the Cu2O structure and morphology is strongly affected by the substrate choice, with V shape and U shape columnar growth on n-Si(100) and Ni/n-Si(100), respectively. Atomic force microscopy reveals the presence of rounded grains at the surface in both cases. Anomalous and normal roughening are observed in films grown on n-Si and Ni, respectively, but estimates of scaling exponents are not conclusive. On the other hand, the distributions of local heights, roughness, and extremal heights show good agreement with those of the fourth order linear stochastic equation of Mullins and Herring (MH). Thus, surface dynamics in both systems is dominated by diffusion of adsorbed molecules, with no large scale effect of possible inhomogeneities in mass flux from the solution or in reaction and adsorption rates. In growth on n-Si substrates, the noise amplitude of the MH equation increases in time as t^{0.8}, while the coefficient of the curvature-related term is time-independent. Step edge energy barriers restrict the mass flux across grain boundaries, thus a broad size distribution of initial grains leads to coarsening of the larger ones. This explains their V shape in the thickest films and establishes a connection with the anomalous roughening. These effects are reduced in films grown on Ni/n-Si, which initially have much larger grains with narrower size distributions and, consequently, smaller fluctuations in coarse grained growth rates.

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