薄膜剪切分层中界面裂纹的粗化与钉扎
Roughening and pinning of interface cracks in shear delamination of thin films
摘要：
我们研究了沿薄膜和刚性基底之间界面的剪切裂纹的粗糙化。我们表明，短程相关波动的界面强度导致自仿射粗糙化的裂纹前端的驱动力（所施加的剪切应力/应力强度因子）增加到一个临界值。我们调查的裂纹位移场和裂纹能量的无序引起的扰动，并使用的结果来确定裂纹钉扎力和评估的形状的临界裂纹。通过与界面开裂模拟的比较，验证了分析参数。
英文摘要：
We investigate the roughening of shear cracks running along the interface between a thin film and a rigid substrate. We demonstrate that short-range correlated fluctuations of the interface strength lead to self-affine roughening of the crack front as the driving force (the applied shear stress/stress intensity factor) increases towards a critical value. We investigate the disorder-induced perturbations of the crack displacement field and crack energy, and use the results to determine the crack pinning force and to assess the shape of the critical crack. The analytical arguments are validated by comparison with simulations of interface cracking.
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